On Top of Every Challenge

Thermal Management Materials

On Top of Every Challenge

Thermal Solutions for Next-Generation Automotive Electronics

Driving Automotive Advancement

Thermal Solutions for Next-Generation Automotive Electronics

Maximum Thermal Control for Superb Processing Power

Computing Capability

Maximum Thermal Control for Superb Processing Power

Excellent Heat Management for portable Devices

Thermal Materials for Handheld & Tablet

Excellent Heat Management for portable Devices

Extensive Claims - Consequent Cooling

Thermal Management for Telecommunications

Extensive Claims - Consequent Cooling

Henkel's Thermal Materials: Solutions for Thermal Management

Since 1964, Henkel’s Bergquist brand has led the market with innovative formulations to tackle electronics’ toughest thermal control issues. With GAP PAD, GAP FILLER, SIL-PAD, phase change, thermal grease and adhesive options within Henkel’s broad portfolio, choice and customization are unrivaled. As the original developer of pad-based GAP PAD thermal interface materials, the Bergquist brand has become synonymous with effective and reliable solutions for moving heat away from critical devices to ensure excellent performance.