Thermal Solutions for Next-Generation Automotive Electronics

Driving Automotive Advancement

Thermal Solutions for Next-Generation Automotive Electronics

Thermal Management for Automotive Electronics

Automotive innovation continues to be fueled by advances in electronics capability and the increasing integration of these technologies into modern vehicles. The prioritization of emission reduction, safety, fuel efficiency, high reliability and superior performance relies on high-functioning electronic automotive systems which, consequently, place increasing demands on thermal performance.

 

More densely populated circuit boards, high-powered battery technology, power steering modules and massive engine control capability all demand unfailing thermal management for reliable function. Henkel’s comprehensive portfolio of GAP PADS, liquid dispensed GAP FILLERS, SIL-PADS and phase change thermal interface materials are meeting the challenging requirements for supporting energy efficiency, safety-critical components for autonomous driving, and next-generation electric vehicles platforms.

GAP FILLERS

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

Supply Chain Simplification

Liquid, form-in-place GAP FILLERS are adaptable to multiple applications, allowing single part sourcing for a variety of different jobs. Instead of ordering large quantities pads or films – where each variety of size and thickness is a different part number – a single GAP FILLER product can satisfy thermal control requirements for several products. Simply dispense where needed, the material forms in place and thermal control is achieved. One product, many applications.

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

More GAP FILLER Advantages

  • Supply Chain Simplification
  • Vision system designed (for detection)
  • Automation-enabled High Throughput
  • High Thermal Performance
  • High Thermal Conductivity
  • Proven equipment capability
  • High value processing
  • High Utilisation
  • Improves reliability
  • Low Component Stress
  • Low-volatility formulations

Adhesives

High-Throughput Processing

For high-volume operations where automation is non-negotiable, Henkel’s adhesive thermal interface products in liquid, pad and laminate formulations answer the call. Liqui-Bond, Bond-Ply and Bond-Ply LMS offer maximum adhesion in mediums that can be automated either by automatic dispensing equipment or custom solutions for maximum productivity.

More Adhesives Advantages

  • Liquid:
  • High throughput
  • Proven equipment capability
  • High value processing
  • Higher thermal performance
  • Long term cost saving effect (total cost of ownership, TCoO)
  • Zero waste
  • Reduces component stress
  • Tapes / Pads:
  • High dielectric strength (for one product)
  • High adhesion to metals
  • Mixed:
  • Eliminates mechanical mounting
  • Increased reliability

GAP PADS

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Quick custom samples
  • Assembly flexibility
  • Custom sizes
  • Silicone-free options
  • Low-modulus formulations
  • Thick bondline
  • Reworkability

SIL-PADS

Why SIL-PADS?

  • Excellent thermal performance
  • Clean, mess-free alternative to grease
  • Provides electrical shorting resistance
  • Simplified, clean application
  • Customizable for various applications

Phase Change

Why Phase Change?

  • Mess-free alternative to thermal grease; remains solid until specified flow temperature
  • Exceptional thermal performance for CPU reliability
  • Simplified handling; tack-free, tackified and printable formulations

Our recommended Thermal Management Products

GAP FILLER

GAP FILLER 1000SR (Two-Part)

Two-part, liquid gap-filling material featuring superior slump resistance

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 20
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 1500 (Two-Part)

Two-part, liquid gap-filling material with high-shear thinning for ease of dispensing

  • Pot Life @ 25ºC (min): 60 min
  • Cure @ 25ºC (min): 5 hours
  • Cure @ 100ºC (min): 10 min
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 1500LV

Two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 8
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 3500S35 (Two-Part)

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 3500LV

High-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 4000

High-performance, two-part, liquid gap-filling material

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 4.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 1400SL

Thermally Conductive, Self-Leveling, Liquid Gap Filling Material

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 1.4
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Adhesives

Bond-Ply LMS-HD

Silicone, high-durability laminate material

  • Thickness (inch) / (mm): 0.010, 0.018
  • Lap Shear @ RT (psi) / (MPa): 200

Liqui-Bond SA 2000 (one-part)

One-component, thermally-conductive silicone adhesive

  • Viscosity (cps): 200,000
  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

TLB 400 SLT

High Performance Silicone Adhesive Sealant With An Adaptable Cure Profile

  • Volume Resistivity (Ohm-meter): 10^12
  • Shelf Life @ 25ºC (months): 6

GAP PAD

GAP PAD 1450

Permanent liner, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 1.3

GAP PAD 1500

Unreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.200
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 3004SF

Permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD 3500ULM

Ultra-low modulus, fiberglassreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.5

GAP PAD HC 3.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

SIL-PAD

SIL-PAD 400

The original fiberglass-reinforced, siliconebased insulator

  • Thickness (inch) / (mm): 0.007, 0.009
  • Dielectric Breakdown Voltage (Vac): 3500, 4500
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 900S

Value fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009
  • Dielectric Breakdown Voltage (Vac): 5500
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1100ST (Soft Tack)

Thermally Conductive, Polyimide Reinforced, Laminate Material-Silicone

  • Thickness (inch) / (mm): 0.012
  • Dielectric Breakdown Voltage (Vac): 5000
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1200

High-performance, fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009 to 0.016
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^9
  • Flame Rating: V-O

SIL-PAD 1500ST (Soft Tack)

Low-pressure, high-performance, siliconebased insulator

  • Thickness (inch) / (mm): 0.008
  • Dielectric Breakdown Voltage (Vac): 3000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD K-10

High Performance, Value Compound for High-End Computer Processors

  • Thickness (inch) / (mm): 0.006
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: VTM-O

Q-Pad II

Aluminum-foil substrate, silicone-based grease replacement

  • Thickness (inch) / (mm): 0.006
  • Dielectric Breakdown Voltage (Vac): Non-Insulating
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: V-O

Phase Change

Hi-Flow 300P

Dry compound, coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.6
  • Phase Change Temp (°F) / (°C): 131
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.004-0.005

Hi-Flow 650P

One side is naturally tacky. Coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.5
  • Phase Change Temp (°F) / (°C): 126
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.0045 - 0.0055

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113

Loctite TCP 7000

Non-silicone and reworkable phase change material

  • Thermal Conductivity (W/m-K): > 3.0
  • Phase Change Temp (°F) / (°C): 113

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