Extensive Claims - Consequent Cooling

Thermal Management for Telecommunications

Extensive Claims - Consequent Cooling

Thermal Materials for Datacomm Infrastructure

Big data is getting bigger. And faster. The volume of data being generated and the speed at which it is being transferred and processed is mind boggling. All of this data is moving at lighting speed to the cloud, where it is routed, processed and stored. Unlike the name implies, the cloud is not some cool, airy data puff in the sky. In reality, it is many huge, earth-bound buildings called data centers. And they’re hot. The switch from wired to fiber optic connectivity between data centers and racks is stressing optical transceiver capability and, yes, increasing the heat generated by high speeds and big data volumes. Henkel’s thermal solutions such as GAP PADS, liquid GAP FILLERS and phase change thermal interface materials are delivering the thermal management capability required for high-reliability datacom performance. Our super-quiet fan designs are offering rack and data center air movement for cooler, quieter environments. Plus, we’re already working on next-generation materials to support even higher speeds and new technologies; these new products will help big data get even bigger.

GAP PADS

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Quick custom samples
  • Custom sizes
  • Silicone-free options
  • Low-modulus formulations
  • High-compliance materials
  • Thick bondline
  • Reworkability

GAP FILLERS

Minimal Waste

GAP FILLERS are only dispensed where needed in the desired thickness and pattern, keeping material waste to a minimum. 

 

As the materials are two-part with activation occurring only when each component is mixed, GAP FILLERS are on-demand products used only in the desired volumes as needed, which reduces material waste significantly.

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

More GAP FILLER Advantages

  • Fewer part numbers
  • Total cost of ownership (TcoO)
  • High value processing
  • Minimal Waste
  • Highly conformal (ultra conformability)
  • Improves reliability
  • Low Component Stress
  • Reworkability

Our recommended Thermal Material Products

GAP PAD

GAP PAD VO

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1450

Permanent liner, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 1.3

GAP PAD 1500

Unreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.200
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 3500ULM

Ultra-low modulus, fiberglassreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.5

GAP PAD HC 3.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

GAP FILLER

GAP FILLER 1500LV

Two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 8
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 3500S35 (Two-Part)

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 3500LV

High-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 4000

High-performance, two-part, liquid gap-filling material

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 4.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

Adhesives

Bond-Ply 100

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008, 0.011
  • Lap Shear @ RT (psi) / (MPa): 100
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply 800

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008
  • Lap Shear @ RT (psi) / (MPa): 150
  • Thermal Conductivity (W/m-K): 0.8

Liqui-Bond EA 1805

Two-component, epoxy-based, liquid-dispensable adhesive

  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^14
  • Shelf Life @ 25ºC (months): 6

Phase Change

TCF 4000

Non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113

Solutions for every Need

We offer innovative, intelligent solutions for all categories to meet every requirement

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