Reliable Modern-Day Convenience

Smart, Connected Appliances

Reliable Modern-Day Convenience

Thermal Materials for Home Appliances

The IoT-enabled connected home is allowing consumers unprecedented levels of control and convenience, especially when it comes to home appliance technology. Checking the refrigerator contents while shopping at the market, starting the washing machine from your car on the way to work and turning off forgotten appliances remotely are all activities made possible by advances in home appliance electronics. And, appliances with increasing function are made more reliable through the use of advanced thermal control materials from Henkel. Our expansive portfolio of thermal management products ensures a solution for just about every application. When the compressor and fan motor on a refrigerator has a thinner gap, for example, and needs electrical isolation from the heat sink, SIL-PAD is the ideal thermal technology. Motor controllers with wider gaps benefit from low assembly stress GAP PAD materials. When automation, material utilization and stress are important considerations, liquid GAP FILLERS fill the void. Smart appliances are driving growth and Henkel’s thermal materials are driving performance and reliability.

SIL-PADS

Why SIL-PADS?

  • Clean, mess-free alternative to grease
  • Superior durability as compared to mica
  • Simplified, clean application
  • Under time and pressure, thermal resistance will decrease

GAP PADS

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Custom sizes
  • Thick bondline

GAP FILLERS

Supply Chain Simplification

Liquid, form-in-place GAP FILLERS are adaptable to multiple applications, allowing single part sourcing for a variety of different jobs. Instead of ordering large quantities pads or films – where each variety of size and thickness is a different part number – a single GAP FILLER product can satisfy thermal control requirements for several products. Simply dispense where needed, the material forms in place and thermal control is achieved. One product, many applications.

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

More GAP FILLER Advantages

  • Fewer part numbers
  • Supply Chain Simplification
  • Automation-enabled High Throughput
  • Low labour
  • Improves reliability

Our recommended Thermal Material Products

SIL-PAD

SIL-PAD 400

The original fiberglass-reinforced, siliconebased insulator

  • Thickness (inch) / (mm): 0.007, 0.009
  • Dielectric Breakdown Voltage (Vac): 3500, 4500
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 900S

Value fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009
  • Dielectric Breakdown Voltage (Vac): 5500
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1100ST (Soft Tack)

Thermally Conductive, Polyimide Reinforced, Laminate Material-Silicone

  • Thickness (inch) / (mm): 0.012
  • Dielectric Breakdown Voltage (Vac): 5000
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1200

High-performance, fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009 to 0.016
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^9
  • Flame Rating: V-O

SIL-PAD K-10

High Performance, Value Compound for High-End Computer Processors

  • Thickness (inch) / (mm): 0.006
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: VTM-O

GAP PAD

GAP PAD VO

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1450

Permanent liner, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 1.3

GAP PAD 1500

Unreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.200
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 1500R

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.010 to 0.020
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 2200SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^8
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD HC 3.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

GAP FILLER

GAP FILLER 1000SR (Two-Part)

Two-part, liquid gap-filling material featuring superior slump resistance

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 20
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 1500 (Two-Part)

Two-part, liquid gap-filling material with high-shear thinning for ease of dispensing

  • Pot Life @ 25ºC (min): 60 min
  • Cure @ 25ºC (min): 5 hours
  • Cure @ 100ºC (min): 10 min
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

Adhesives

Bond-Ply 800

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008
  • Lap Shear @ RT (psi) / (MPa): 150
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply LMS-HD

Silicone, high-durability laminate material

  • Thickness (inch) / (mm): 0.010, 0.018
  • Lap Shear @ RT (psi) / (MPa): 200

Liqui-Bond SA 1000 (one-part)

One-component, thermally-conductive, silicone adhesive

  • Viscosity (cps): 125,000
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 2000 (one-part)

One-component, thermally-conductive silicone adhesive

  • Viscosity (cps): 200,000
  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Phase Change

Hi-Flow 300P

Dry compound, coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.6
  • Phase Change Temp (°F) / (°C): 131
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.004-0.005

EIF 1000K3

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

EIF 1000KB

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

EIF 1000KA

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.002

TCF 1000ALH

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

TCF 1000AL

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

TCF 4000

Non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113

Solutions for every Need

We offer innovative, intelligent solutions for all categories to meet every requirement

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