Lighting that takes the Heat

Staying bright and keeping cool

Lighting that takes the Heat

Thermal Materials for Lighting Equipment

The move from halogen and incandescent lighting to LEDs now extends far outside the realm of household use. Today, LEDs are used in consumer, architectural, industrial and automotive applications, just to name a few. Ensuring reliable and effective thermal control is critical to proper lighting function and product longevity. Managing the heat produced from multi-LED automotive headlamps, automating TIM processes for cost-effective consumer lighting and offering numerous material solutions for multi-function lighting fixtures, Henkel’s comprehensive thermal portfolio provides flexibility and performance for modern lighting manufacturers. Henkel has led the way in the lighting sector, first with GAP PADS for consumer lighting products, then with THERMAL CLAD (T-CLAD) Insulated Metal Substrates for consumer and industrial products to our latest low volatility liquid GAP FILLER material with low outgassing to avoid lens fogging, which is particularly important in the automotive space. No matter what the lighting challenge, Henkel has you covered.

GAP PADS

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Custom sizes
  • Soft and compliant
  • Compliancy
  • Silicone-free options

GAP FILLERS

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

More GAP FILLER Advantages

  • Automation-enabled High Throughput
  • Low labour
  • Improves reliability
  • Low-volatility formulations

SIL-PADS

Why SIL-PADS?

  • Excellent thermal performance
  • Clean, mess-free alternative to grease
  • More cost-effective than ceramic
  • Provides electrical shorting resistance
  • Simplified, clean application
  • Customizable for various applications

Our recommended Thermal Material Products

GAP PAD

GAP PAD VO

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1000SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 0.9

GAP PAD 2200SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^8
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD 3004SF

Permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD HC 3.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

GAP FILLER

GAP FILLER 1500 (Two-Part)

Two-part, liquid gap-filling material with high-shear thinning for ease of dispensing

  • Pot Life @ 25ºC (min): 60 min
  • Cure @ 25ºC (min): 5 hours
  • Cure @ 100ºC (min): 10 min
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 1500LV

Two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 8
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 3500LV

High-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

SIL-PAD

SIL-PAD 400

The original fiberglass-reinforced, siliconebased insulator

  • Thickness (inch) / (mm): 0.007, 0.009
  • Dielectric Breakdown Voltage (Vac): 3500, 4500
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 900S

Value fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009
  • Dielectric Breakdown Voltage (Vac): 5500
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1200

High-performance, fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009 to 0.016
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^9
  • Flame Rating: V-O

SIL-PAD 2000

Higher-performance, fiberglass-reinforced, silicone-based insulator. Designed for military and aerospace applications

  • Thickness (inch) / (mm): 0.010 - 0.020
  • Dielectric Breakdown Voltage (Vac): 4000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 1500ST (Soft Tack)

Low-pressure, high-performance, siliconebased insulator

  • Thickness (inch) / (mm): 0.008
  • Dielectric Breakdown Voltage (Vac): 3000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

Q-Pad 3

Fiberglass-reinforced, silicone-based grease replacement

  • Dielectric Breakdown Voltage (Vac): Non-Insulating
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: V-O

Phase Change

Hi-Flow 300P

Dry compound, coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.6
  • Phase Change Temp (°F) / (°C): 131
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.004-0.005

Hi-Flow 650P

One side is naturally tacky. Coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.5
  • Phase Change Temp (°F) / (°C): 126
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.0045 - 0.0055

TCF 1000ALH

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

TCF 1000AL

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

TCF 4000

Non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113

Adhesives

Bond-Ply 100

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008, 0.011
  • Lap Shear @ RT (psi) / (MPa): 100
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply 800

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008
  • Lap Shear @ RT (psi) / (MPa): 150
  • Thermal Conductivity (W/m-K): 0.8

Liqui-Bond EA 1805

Two-component, epoxy-based, liquid-dispensable adhesive

  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^14
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 2000 (one-part)

One-component, thermally-conductive silicone adhesive

  • Viscosity (cps): 200,000
  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Solutions for every Need

We offer innovative, intelligent solutions for all categories to meet every requirement

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