Reliability for what matters most

Medical Electronics

Reliability for what matters most

Thermal Materials for Medical and Instrumentation

The reliability of life-saving medical equipment is vital; monitors, imaging technology, radiology systems and countless other medical technologies have to function properly for successful patient diagnosis and treatment. Effectively and efficiently managing the heat being produced from the electronic components within medical systems is one of the most important factors to ensuring reliability. Henkel’s thermal management materials are the cure. Liquid GAP FILLERS provide low stress, low volatility solutions, which can be important in settings where silicone sensitivity is a concern. Likewise, when pad-based, custom fit materials are preferred, award-winning GAP PADS with low modulus, low stress options provide reliable and effective heat dissipation. These materials are two of numerous thermal control materials within Henkel’s broad portfolio of solutions for modern medical systems.

GAP PADS

Requires no capital investment

Exceptionally simple to use, Henkel’s GAP PAD materials require no up-front capital investment as the pads can be applied quickly and easily by hand.

 

Manufactured to size, operators simply peel the protective film and place the pad on the desired component.

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Requires no capital investment
  • Custom sizes
  • Low-modulus formulations

GAP FILLERS

Why GAP FILLERS?

  • Fewer part numbers
  • Supply Chain Simplification
  • Automation-enabled High Throughput
  • Minimal Waste
  • Highly conformal (ultra conformability)
  • Improves reliability
  • Low Component Stress
  • Low-volatility formulations

SIL-PADS

Why SIL-PADS?

  • Clean, mess-free alternative to grease
  • Superior durability as compared to mica
  • Simplified, clean application
  • Under time and pressure, thermal resistance will decrease

Our recommended Thermal Material Products

GAP PAD

GAP PAD VO

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1000SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 0.9

GAP PAD 2200SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^8
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD 3004SF

Permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD HC 3.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP FILLER

GAP FILLER 1500LV

Two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 8
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 3500LV

High-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 1400SL

Thermally Conductive, Self-Leveling, Liquid Gap Filling Material

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 1.4
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

SIL-PAD

SIL-PAD 2000

Higher-performance, fiberglass-reinforced, silicone-based insulator. Designed for military and aerospace applications

  • Thickness (inch) / (mm): 0.010 - 0.020
  • Dielectric Breakdown Voltage (Vac): 4000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 1500ST (Soft Tack)

Low-pressure, high-performance, siliconebased insulator

  • Thickness (inch) / (mm): 0.008
  • Dielectric Breakdown Voltage (Vac): 3000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

Adhesives

Liqui-Bond SA 1000 (one-part)

One-component, thermally-conductive, silicone adhesive

  • Viscosity (cps): 125,000
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 2000 (one-part)

One-component, thermally-conductive silicone adhesive

  • Viscosity (cps): 200,000
  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Phase Change

Hi-Flow 565UT

Tacky, High Performance, Un-Reinforced Phase Change TIM

  • Thermal Conductivity (W/m-K): 3.0
  • Phase Change Temp (°F) / (°C): 126
  • Thickness (inch) / (mm): 0.005, 0.010

TCF 4000

Non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45

Solutions for every Need

We offer innovative, intelligent solutions for all categories to meet every requirement

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