Thermal Management for Power Applications

Power and Industrial Automation

Thermal Management for Power Applications

Thermal Materials for Power and Industrial Automation

From motor controls to smart meters and wind inverters to EV charging stations, power electronics are a critical functional component of many industrial applications. The conversion and storage of energy is the essence of modern power devices, which are under pressure to reliably provide increasing power in smaller and more custom footprints. Henkel’s thermal management materials portfolio leads the power market when it comes to thermal control solutions, offering exceptional capability for power modules, industrial automation, motion control, power supplies and alternative energy applications. Each power system has unique requirements and Henkel’s broad range of thermal control technologies ensures consistent, reliable performance. From efficiently conducting heat at the board level with T-CLAD insulated metal substrates to replacing greases with higher performance phase change materials to superior heat dissipation with thermal adhesives, GAP PADS and liquid GAP FILLER TIMs, Henkel’s thermal solutions for power applications are unmatched.

GAP PADS

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Quick custom samples
  • Custom sizes

GAP FILLERS

Supply Chain Simplification

Liquid, form-in-place GAP FILLERS are adaptable to multiple applications, allowing single part sourcing for a variety of different jobs. Instead of ordering large quantities pads or films – where each variety of size and thickness is a different part number – a single GAP FILLER product can satisfy thermal control requirements for several products. Simply dispense where needed, the material forms in place and thermal control is achieved. One product, many applications.

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

More GAP FILLER Advantages

  • Supply Chain Simplification
  • Automation-enabled High Throughput
  • Low labour
  • Highly conformal (ultra conformability)
  • Improves reliability

Adhesives

Why Adhesives?

  • Liquid:
  • Long term cost saving effect (total cost of ownership, TCoO)
  • Tapes / Pads:
  • High dielectric strength (for one product)
  • High adhesion to metals
  • Mixed:
  • Eliminates mechanical mounting

SIL-PADS

Why SIL-PADS?

  • Excellent thermal performance
  • Clean, mess-free alternative to grease
  • Provides electrical shorting resistance
  • Simplified, clean application
  • Customizable for various applications

Our recommended Thermal Material Products

GAP PAD

GAP PAD VO

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP FILLER

GAP FILLER 1500 (Two-Part)

Two-part, liquid gap-filling material with high-shear thinning for ease of dispensing

  • Pot Life @ 25ºC (min): 60 min
  • Cure @ 25ºC (min): 5 hours
  • Cure @ 100ºC (min): 10 min
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

GAP FILLER 3500S35 (Two-Part)

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

Adhesives

Bond-Ply 100

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008, 0.011
  • Lap Shear @ RT (psi) / (MPa): 100
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply 800

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008
  • Lap Shear @ RT (psi) / (MPa): 150
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply LMS-HD

Silicone, high-durability laminate material

  • Thickness (inch) / (mm): 0.010, 0.018
  • Lap Shear @ RT (psi) / (MPa): 200

Liqui-Bond SA 1000 (one-part)

One-component, thermally-conductive, silicone adhesive

  • Viscosity (cps): 125,000
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 2000 (one-part)

One-component, thermally-conductive silicone adhesive

  • Viscosity (cps): 200,000
  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

SIL-PAD

SIL-PAD 400

The original fiberglass-reinforced, siliconebased insulator

  • Thickness (inch) / (mm): 0.007, 0.009
  • Dielectric Breakdown Voltage (Vac): 3500, 4500
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 900S

Value fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009
  • Dielectric Breakdown Voltage (Vac): 5500
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1200

High-performance, fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009 to 0.016
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^9
  • Flame Rating: V-O

SIL-PAD 2000

Higher-performance, fiberglass-reinforced, silicone-based insulator. Designed for military and aerospace applications

  • Thickness (inch) / (mm): 0.010 - 0.020
  • Dielectric Breakdown Voltage (Vac): 4000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 1500ST (Soft Tack)

Low-pressure, high-performance, siliconebased insulator

  • Thickness (inch) / (mm): 0.008
  • Dielectric Breakdown Voltage (Vac): 3000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD K-10

High Performance, Value Compound for High-End Computer Processors

  • Thickness (inch) / (mm): 0.006
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: VTM-O

Q-Pad 3

Fiberglass-reinforced, silicone-based grease replacement

  • Dielectric Breakdown Voltage (Vac): Non-Insulating
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: V-O

Phase Change

Hi-Flow 300P

Dry compound, coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.6
  • Phase Change Temp (°F) / (°C): 131
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.004-0.005

Hi-Flow 650P

One side is naturally tacky. Coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.5
  • Phase Change Temp (°F) / (°C): 126
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.0045 - 0.0055

EIF 1000K3

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

EIF 1000KB

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

EIF 1000KA

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.002

TCF 1000ALH

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

TCF 1000AL

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

TCF 4000

Non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113

Loctite TCP 7000

Non-silicone and reworkable phase change material

  • Thermal Conductivity (W/m-K): > 3.0
  • Phase Change Temp (°F) / (°C): 113

Solutions for every Need

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