Comprehensive Thermal Materials from Henkel
No matter what the preferred format, thermal conductivity requirement or base chemistry preference, Henkel’s Bergquist thermal materials portfolio has you covered. We pioneered the industry’s original soft, low-stress, compliant GAP PAD thermal interface materials in the early 90's and, since then, have built on this expertise to deliver an expansive range of products that deliver robust and reliable thermal control. Form-in-place liquid dispensed GAP FILLERS in a variety of formulations – including low-volatility and self-leveling – allow for automation, improved throughput and robust thermal management for devices with challenging architectures. SIL-PAD thermally conductive insulators are an ideal alternative to mica, ceramics and greases. These products, in addition to Henkel’s adhesives and phase change materials, offer a total solution for all your thermal management needs.