Adhesives

Bond-Ply 100

Features & Benefits

  • Thermal impedance 0.52°C-in2/W (@50 psi)
  • High bond strength to a variety of surfaces
  • Double-sided, pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat-cure adhesive, screw mounting or clip mounting.

Description

Fiberglass-reinforced pressure-sensitive adhesive tape

Typical Applications include

  • Mount heat sink onto BGA graphic processor or drive processor
  • Mount heat spreader onto power converter PCB or onto motor control PCB

Properties

Typical properties of Bond-Ply 100
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Fiberglass Fiberglass ***
Color White White Visual
Typical Use Temp (°F) / (°C) -22 to 248 -30 to 120 ***
Thickness (inch) / (mm) 0.005, 0.008, 0.011 0.127, 0.203, 0.279 ASTM D374
Elongation (%45° to Warp and Fill) 70 70 ASTM D412
Tensile Strength (psi) / (MPa) 900 6 ASTM D412
CTE (ppm) 325 325 ASTM D3386
Glass Transition (ºF) / (ºC) -22 -30 ASTM 1356
Temp. Resistance, 30 sec. (ºF) / (ºC) 392 200 ***
Typical properties of Bond-Ply 100
Electrical Imperial Value Metric Value Test Method
Dielectric Breakdown Voltage - 0.005" (Vac) 3000 ASTM D149
Dielectric Breakdown Voltage - 0.008" (Vac) 6000 ASTM D149
Dielectric Breakdown Voltage - 0.011" (Vac) 8500 ASTM D149
Typical properties of Bond-Ply 100
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) 0.8 ASTM D5470
Typical properties of Bond-Ply 100
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.005" 5.17 4.87 4.49 4.18 4.10
TO-220 Thermal Performance (°C/W) 0.008" 5.40 5.35 5.28 5.22 5.20
TO-220 Thermal Performance (°C/W) 0.011" 0.56 0.54 0.52 0.50 0.50
Thermal Impedance (ºC-in2/W) 0.005" 0.56 0.54 0.52 0.50 0.50
Thermal Impedance (ºC-in2/W) 0.008" 0.82 0.80 0.78 0.77 0.75
Thermal Impedance (ºC-in2/W) 0.011" 1.03 1.02 1.01 1.00 0.99
TO-220 Thermal Performance (°C/W) 0.010" 6.59 6.51 6.51 6.50 6.40
Typical properties of Bond-Ply 100
Electrical Value Test Method
Flame Rating V-O U.L.94
Typical properties of Bond-Ply 100
Adhesion Imperial Value Metric Value Test Method
Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002
Lap Shear after 5 hr @ 100ºC 200 1.4 ASTM D1002
Lap Shear after 2 min @ 200ºC 200 1.4 ASTM D1002
Static Dead Weight Shear (ºF) / (ºC) 302 150 PSTC #7

Configurations

Configurations available

  • Sheet form, roll form and die-cut parts
Shelf Life: The double-sided, pressure sensitive adhesive used in Bond-Ply products require the use of dual liners to protect the surfaces from contaminants. Henkel recommends a 6-month shelf life at a maximum continuous storage temperature of 35°C, or 3-month shelf life at a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60°C.

Downloads

Data Sheet

Adhesives

Data Sheet

Bond-Ply 100

RoHS Certificate

Adhesives

RoHS Certificate

Bond-Ply 100

Halogen Testing Report

Adhesives

Halogen Testing Report

Bond-Ply 100

Safety Data Sheet (SDS)

Adhesives

Safety Data Sheet (SDS)

Bond-Ply 100
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