Adhesives

Bond-Ply LMS-HD

Features & Benefits

  • TO-220 Thermal performances: 2.3°C/W, initial pressure only lamination
  • Exceptional dielectric strength
  • Very low interfacial resistance
  • Continuous use of -60 to 180°C
  • Eliminates mechanical fasteners

Description

Bond-Ply® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films. The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch, shock and vibration while providing exceptional thermal performance (vs PSA technologies) and long-term integrity. Bond-Ply® LMS-HD will typically be used for structurally adhering power components and PCBs to a heat sink.

Typical Applications include

  • Discrete semi-conductor packages bonded to heat spreader or heat sink

Properties

Typical properties of Bond-Ply LMS-HD
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Fiberglass Fiberglass ***
Color Yellow Yellow Visual
Typical Use Temp (°F) / (°C) -76 to 356 -60 to 180 ***
Thickness (inch) / (mm) 0.010, 0.018 0.254, 0.457 ASTM D374
Typical properties of Bond-Ply LMS-HD
Electrical Value Test Method
Flame Rating V-O U.L. 94
Breakdown Voltage, Sheet (Vac) 5000 ASTM D149
Breakdown Voltage, Laminated (Vac) 4000 ASTM D149
Dielectric Constant (1000 Hz) 5.0 ASTM D150
Volume Resistivity (Ohm-meter) 10^11 ASTM D257
Typical properties of Bond-Ply LMS-HD
Thermal Value Test Method
Post-Cured Thermal Conductivity (W/m-K) (1) 1.4 ASTM D5470
Typical properties of Bond-Ply LMS-HD
Lamination Pressure (75 psi) Constant IPO
TO-220 Thermal Performance (°C/W) 2.1 2.3
Typical properties of Bond-Ply LMS-HD
Adhesion Imperial Value Metric Value Test Method
Lap Shear @ RT (psi) / (MPa) (2) 200 1.4 ASTM D1002
  • (1) The ASTM D5470 (Henkel Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only.

  • (2) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle.

Configurations

Configurations available

  • Roll form
  • Die-cut parts
  • Sheet form
Shelf Life: The Bond-Ply LMS-HD is a heat-cured material and should be stored in temperature controlled conditions. The recommended storage temperature range of 5-25°C should be used to maintain optimum characteristics for a 5-month shelf life.

Downloads

Data Sheet

Adhesives

Data Sheet

Bond-Ply LMS-HD

RoHS Certificate

Adhesives

RoHS Certificate

Bond-Ply LMS-HD

Halogen Testing Report

Adhesives

Halogen Testing Report

Bond-Ply LMS-HD

Safety Data Sheet (SDS)

Adhesives

Safety Data Sheet (SDS)

Bond-Ply LMS-HD
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