Gap Pad

Gap Pad HC 3.0

Features & Benefits

  • Thermal conductivity: 3.0 W/m-K
  • Highly conformable, low compression stress
  • Fiberglass reinforced for shear and tear resistance

Description

Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress. Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

Typical Applications include

  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks

Properties

Typical properties of Gap Pad HC 3.0
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Fiberglass Fiberglass ***
Color Blue Blue Visual
Inherent Surface Tack 2 2 ***
Density (Bulk Rubber) (g/cc) 3.1 3.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1) 15 15 ASTM D2240
Young's Modulus (psi) / (kPa) (2) 16 110 ASTM D575
Typical Use Temp (°F) / (°C) -76 to 392 -60 to 200 ***
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Typical properties of Gap Pad HC 3.0
Electrical Imperial Value Metric Value Test Method
Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149
Dielectric Constant (1000 Hz) (3) 6.5 6.5 ASTM D150
Volume Resistivity (Ohm-meter) 10^10 10^10 ASTM D257
Flame Rating V-O V-O U.L. 94
Typical properties of Gap Pad HC 3.0
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) (3) 3.0 3.0 ASTM D5470
Typical properties of Gap Pad HC 3.0
Property Value Test Method
Shield / Copper Thickness (inches) 1
Typical properties of Gap Pad HC 3.0
Deflection (% strain) 10 20 30
Thermal Impedance (ºC-in2/W) 0.040" 0.57 0.49 0.44
  • (1) Thirty second delay value on Shore 00 hardness scale.

  • (2) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch^2 after 5 minutes of compression at 10% strain on a 1mm thickness material.

  • (3) Minimum value at 20 mil.

Configurations

Configurations available

  • Sheet form and die-cut parts

Downloads

Data Sheet

Gap Pad

Data Sheet

Gap-Pad HC 3.0

RoHS Certificate

Gap Pad

RoHS Certificate

Gap-Pad HC 3.0

Halogen Testing Report

Gap Pad

Halogen Testing Report

Gap-Pad HC 3.0

Safety Data Sheet (SDS)

Gap Pad

Safety Data Sheet (SDS)

Gap-Pad HC 3.0
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