Gap Pad

Gap Pad HC 5.0

Features & Benefits

  • Thermal Conductivity: 5.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance

Description

GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. GAP PAD™ HC 5.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

Typical Applications include

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal modules to heat sinks

Properties

Typical properties of Gap Pad HC 5.0
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Fiberglass Fiberglass ***
Color Violet Violet Visual
Inherent Surface Tack 2 2 ***
Density (Bulk Rubber) (g/cc) 3.2 3.2 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1) 35 35 ASTM 2240
Young's Modulus (psi) / (kPa) (2) 17.5 121 ASTM D575
Typical Use Temp (°F) / (°C) -76 to 392 -60 to 200 ***
Thickness (inch) / (mm) (3) 0.020 - 0.125 0.508 - 3.175 ASTM D374
Typical properties of Gap Pad HC 5.0
Electrical Imperial Value Metric Value Test Method
Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149
Dielectric Constant (1000 Hz) 8.0 8.0 ASTM D150
Volume Resistivity (Ohm-meter) 10^10 10^10 ASTM D257
Flame Rating V-O V-O U.L. 94
Typical properties of Gap Pad HC 5.0
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) (4) 5.0 5.0 ASTM D5470
Typical properties of Gap Pad HC 5.0
Property Value Test Method
Shield / Copper Thickness (inches) 1
Typical properties of Gap Pad HC 5.0
Deflection (% strain) 10 20 30
Thermal Impedance (ºC-in2/W) 0.040" 0.32 0.29 0.25
  • (1) Thirty second delay value on Shore 00 hardness scale.

  • (2) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch^2 after 5 minutes of compression at 10% strain on a 1mm thickness material.

  • (3) Custom thicknesses available. Please contact your Henkel Sales Representative for more information.

  • (4) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

Configurations

Downloads

Data Sheet

Gap Pad

Data Sheet

Gap-Pad HC 5.0

RoHS Certificate

Gap Pad

RoHS Certificate

Gap-Pad HC 5.0

Halogen Testing Report

Gap Pad

Halogen Testing Report

Gap-Pad HC 5.0

Safety Data Sheet (SDS)

Gap Pad

Safety Data Sheet (SDS)

Gap-Pad HC 5.0
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