Phase Change

Hi-Flow 300P

Features & Benefits

  • Thermal impedance: 0.13°C-in2/W (@25 psi)
  • Field-proven polyimide film
  • -excellent dielectric performance
  • -excellent cut-through resistance
  • Outstanding thermal performance in an insulated pad

Description

Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle, and the 55°C phase change temperature minimizes shipping and handling problems. Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on a easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. Henkel suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application.

Typical Applications include

  • Spring / clip mounted
  • Discrete power semiconductors and modules

Properties

Typical properties of Hi-Flow 300P
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Polymide Polymide ***
Color Green Green Visual
Typical Use Temp (°F) / (°C) 302 150 ***
Phase Change Temp (°F) / (°C) 131 55 ASTM D3418
Thickness (inch) / (mm) 0.004-0.005 0.102-0.127 ASTM D374
Elongation (%45° to Warp and Fill) 40 40 ASTM 882A
Tensile Strength (psi) / (MPa) 7000 48 ASTM 882A
Film Thickness (inch) / (mm) 0.001-0.002 0.025-0.050 ASTM D374
Typical properties of Hi-Flow 300P
Electrical Imperial Value Metric Value Test Method
Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149
Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150
Volume Resistivity (Ohm-meter) 10^12 10^12 ASTM D257
Flame Rating V-O V-O U.L. 94
Typical properties of Hi-Flow 300P
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) (1) 1.6 1.6 ASTM D5470
Typical properties of Hi-Flow 300P
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.010" 0.95 0.94 0.92 0.91 0.90
TO-220 Thermal Performance (°C/W) 0.015" 1.19 1.17 1.16 1.14 1.12
TO-220 Thermal Performance (°C/W) 0.020" 1.38 1.37 1.35 1.33 1.32
Thermal Impedance (ºC-in2/W) 0.010" 0.13 0.13 0.12 0.12 0.12
Thermal Impedance (ºC-in2/W) 0.015" 0.17 0.16 0.16 0.16 0.15
Thermal Impedance (ºC-in2/W) 0.020" 0.19 0.19 0.19 0.18 0.18
  • (1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall c

Configurations

Configurations available

  • Foll form, die-cut parts and sheet form, dry both sides

Downloads

Data Sheet

Phase Change

Data Sheet

Hi-Flow 300P

Standard Configuration (Metric)

Phase Change

Standard Configuration (Metric)

Hi-Flow 300P

Standard Configuration (Imperial)

Phase Change

Standard Configuration (Imperial)

Hi-Flow 300P

RoHS Certificate

Phase Change

RoHS Certificate

Hi-Flow 300P

Halogen Testing Report

Phase Change

Halogen Testing Report

Hi-Flow 300P

Safety Data Sheet (SDS)

Phase Change

Safety Data Sheet (SDS)

Hi-Flow 300P
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