Adhesives

Liqui-Bond SA 2000 (one-part)

Features & Benefits

  • High thermal conductivity: 2.0 W/m-k
  • Eliminates need for mechanical fasteners
  • One-part formulation for easy dispensing
  • Mechanical and chemical stability
  • Maintains structural bond in severe-environment applications
  • Heat cure

Description

Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. Liqui-Bond SA 2000 features excellent low and high-temperature mechanical and chemical stability. The material's mild elastic properties assist in relieving CTE stresses during thermal cycling. Liqui-Bond SA 2000 cures at elevated temperatures and requires refrigeration storage at 10°C.

Typical Applications include

  • PCBA to housing
  • Discrete component to heat spreader

Properties

Typical properties of Liqui-Bond SA 2000 (one-part)
Properties Imperial Value Metric Value Test Method
Color Yellow Yellow Visual
Density (Bulk Rubber) (g/cc) 2.4 2.4 ASTM D792
Shelf Life @ 25ºC (months) 6 6 ***
Viscosity (cps) (1) 200,000 200,000 ASTM D2196
Typical properties of Liqui-Bond SA 2000 (one-part)
Electrical Imperial Value Metric Value Test Method
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 10^11 10^11 ASTM D257
Flame Rating V-O V-O U.L. 94
Dielectric Strength (V/mil)/(V/mm) 250 10,000 ASTM D149
Typical properties of Liqui-Bond SA 2000 (one-part)
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
Typical properties of Liqui-Bond SA 2000 (one-part)
Property as Cured Imperial Value Metric Value Test Method
Hardness (Shore 00) 80 80 ASTM D2240
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 ***
Shear Strength (psi) / (MPa) 200 1.4 ASTM D1002
Typical properties of Liqui-Bond SA 2000 (one-part)
Cure Schedule Imperial Value Metric Value Test Method
Pot Life @ 25ºC (min) (2) 24 24 ***
Cure @ 125ºC (min) (3) 20 20 ***
Cure @ 150ºC (min) (3) 10 10 ***
  • (1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25ºC.

  • (2) Based on 1/8" diameter bead.

  • (3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.

Configurations

Configurations available

  • With or without glass beads

Downloads

Data Sheet

Adhesives

Data Sheet

Liqui Bond SA2000

RoHS Certificate

Adhesives

RoHS Certificate

Liqui Bond SA2000

Halogen Testing Report

Adhesives

Halogen Testing Report

Liqui Bond SA2000

Safety Data Sheet (SDS)

Adhesives

Safety Data Sheet (SDS)

Liqui Bond SA2000
Thermal Management Videos

Thermal Management Videos

Watch how Thermal Management Materials perform and enrich your knowledge with our Videos.

Watch now