Encapsulants

Henkel Solutions across the Board

Encapsulants

Encapsulants for Protection and Strengh

Encapsulants are used to provide environmental protection and add mechanical strength to wire bonded devices. Two different application technologies are employed for the protective encapsulation of wire bonded die: glob tops and dam and fill technologies.

Dam

LOCTITE 3323

  • Low coefficient of thermal expansion
  • High adhesion to a wide range of substrates normally used as carrier plastics, e.g., glass epoxy, polyimide and polyester

LOCTITE ECCOBOND FP 4451TD

  • High purity
  • Excellent chemical resistance
  • Exceptional thermal stability

Fill

LOCTITE 3327

  • Low coefficient of thermal expansion
  • High adhesion to a wide range of substrates normally used as carrier plastics, e.g., glass epoxy, polyimide and polyester

LOCTITE ECCOBOND FP 4470

  • High purity
  • 260°C reflow capability for Pb-free applications
  • Green product
  • Excellent flow properties

LOCTITE FP4450

  • High purity
  • Low stress
  • Good moisture resistance
  • Exhibits relatively high flow
  • High temperature performance
  • Excellent chemical resistance

Glob Tops

LOCTITE ECCOBOND EN 3838T

  • Low Tg and reworkable
  • Low modulus
  • Pb-free applications

LOCTITE ECCOBOND EO 1072

  • Fast cure
  • High Tg
  • Good shelf life
  • Low extractable ionics

LOCTITE ECCOBOND FP 4323

  • Low CTE for improved thermal cycling
  • High purity
  • Thixotropic
  • Excellent moisture resistance
  • Excellent chemical resistance

LOCTITE ECCOBOND UV 9060F

  • Fluorescent under UV light
  • UV/moisture cure
  • Fast cure
  • Good dispensability

LOCTITE STYCAST EO 7038

  • High thermal and temperature resistance
  • One-component epoxy potting system
  • Formulated to protect sensors used in harsh environments, such as automotive applications

LOCTITE UV 9052

  • Ink resistant
  • Fluorescent under UV light
  • UV/moisture cure
  • Fast cure
  • Good dispensability