Low Pressure Molding: Simple and effective Protection
Henkel’s TECHNOMELT low pressure molding materials are unmatched in their simplicity, performance and value. In three easy steps, even the most delicate of electronic devices and PCBs can be encapsulated, sealed and protected. With excellent adhesion, superb temperature and solvent resistance, and low application pressure processing, TECHNOMELT hot melt materials are the ideal mess-free, cost-effective alternative to conventional potting techniques. The TECHNOMELT molding cycle time is short, enabling high throughput, and its functional design allows manufacturers to remove process steps. In addition to overmolding, peelable TECHNOMELT materials are also an ideal automated replacement for traditional manual masking methods. These novel Henkel materials are successfully being integrated into a variety of products within the automotive, medical, industrial and consumer markets.