Low Pressure Molding Materials

Henkel Solutions across the Board

Low Pressure Molding Materials

Low Pressure Molding: Simple and effective Protection

Henkel’s TECHNOMELT low pressure molding materials are unmatched in their simplicity, performance and value. In three easy steps, even the most delicate of electronic devices and PCBs can be encapsulated, sealed and protected. With excellent adhesion, superb temperature and solvent resistance, and low application pressure processing, TECHNOMELT hot melt materials are the ideal mess-free, cost-effective alternative to conventional potting techniques. The TECHNOMELT molding cycle time is short, enabling high throughput, and its functional design allows manufacturers to remove process steps. In addition to overmolding, peelable TECHNOMELT materials are also an ideal automated replacement for traditional manual masking methods. These novel Henkel materials are successfully being integrated into a variety of products within the automotive, medical, industrial and consumer markets.

Dispensable

TECHNOMELT AS 8998

  • Easily peelable without residues
  • Zero outgassing at 100°C
  • Silicone free
  • Ultra-fast processing
  • Solidifies upon cooling
  • Good resistance to conformal coating ingression
  • Excellent slump resistance up to 100°C
  • Compatible with Henkel conformal coatings

High-temperature Resistance

TECHNOMELT PA 2692

  • High heat resistance
  • Good oil resistance
  • Compatible with Henkel materials
  • Increased thermal stability for the harshest environments

TECHNOMELT PA 678

  • Formerly known as MACROMELT OM 678
  • Easy moldability
  • Good adhesion to a variety of substrates
  • Excellent moisture resistance
  • Excellent environmental resistance
  • Simplified process flow
  • Compatible with Henkel materials
  • Thermally stable for under-the-hood applications and incidental solvent exposure

Increased Hardness

TECHNOMELT PA 646

  • Formerly known as MACROMELT OM 646
  • Easy moldability
  • Good adhesion to a variety of substrates
  • Excellent moisture resistance
  • Excellent environmental resistance
  • Ideal for applications such as computer connectors and memory sticks where high strength and hardness are desired
  • Compatible with Henkel materials
  • Hard, strong material for when mechanical strength is paramount

Specialty Technologies

TECHNOMELT PA 2384

  • Solvent resistant and chemically stable in submersion
  • Polar solvent and hydrocarbon resistant
  • High hardness
  • High operating temperature
  • Improved performance when exposed to industry-standard chemical media
  • Compatible with Henkel materials

TECHNOMELT PA 668

  • White color maintained even when exposed to harsh external factors
  • UV and thermally stabilized
  • Superior molding and color integrity performance
  • Ideal for indoor and outdoor LED lighting, household consumer products and industrial sensors
  • Compatible with Henkel materials

TECHNOMELT PA 668 Clear

  • Transparent
  • UV and thermally stabilized
  • Thermally stable from -25°C to 105°C
  • Low viscosity
  • Good adhesion to PCBs and components
  • Ideal for indoor and outdoor LED lighting, in-cabin automotive sensors and industrial components

TECHNOMELT TC 50

  • Heat dissipation through TECHNOMELT low pressure molding material
  • Thermal conductivity: >0.5 W/mK
  • Substantially decreases component temperature
  • Stable filler dispersion that eliminates settling for continued low pressure molding
  • Low-abrasive filler
  • Compatible with Henkel materials

Low Pressure Molding

You need more information on TECHNOMELTs low pressure molding portfolio? Our external website provides a wide range of data sheets, press releases, videos and other useful downloads.

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