Underfills

Henkel Solutions across the Board

Underfills

Underfills: Reliability for the Mobile Market

Smaller, thinner, highly functional devices are made more reliable and durable with LOCTITE underfills. The undisputed leader in underfill technology, Henkel’s LOCTITE materials provide unmatched reliability performance for modern handheld, wearable and mobile computing devices. LOCTITE CSP and BGA underfill systems accommodate for a variety of applications, providing fast flow, fast cure, long pot life and easy reworkability. Superior shock, drop and vibration resistance characteristics are the hallmarks of LOCTITE underfills, which are enabling today’s the most advanced electronics products.

Non-reworkable

LOCTITE ECCOBOND E 1172A

  • Good adhesion
  • Small gap filling till 25µm
  • Usable in transparent SMT processing
  • Snap cure

LOCTITE ECCOBOND E 1216M

  • Snap curable
  • Fast flow
  • High reliability (1,000 cycles TC -45°C to 85°C)
  • Good drop test performance
  • Good flux compatibility

LOCTITE ECCOBOND FP4531

  • Non-anhydride curing chemistry
  • High Tg
  • Low CTE
  • Fast cure
  • Good reliability
  • Passed TC -40°C to 125°C for 1,000 cycles

Reworkable

LOCTITE ECCOBOND UF 3811

  • One component
  • Room temperature flow capability
  • Halogen-free
  • Reworkable
  • Good thermal cycling reliability
  • Stable electrical performance
  • Surface Insulation Resistance (SIR)

Partial Underfill

LOCTITE 3128

  • Heat cure
  • Designed to cure at a low temperature

LOCTITE 3705

  • UV cure only
  • Fast UV cure
  • Low modulus, very flexible

LOCTITE ECCOBOND 3508NH

  • Cure during reflow
  • Self alignment during reflow
  • Reworkable
  • Halogen-free
  • Eliminates post-reflow dispense and cure steps

LOCTITE ECCOBOND 3707F

  • Easy dispensability without stringing
  • Dual cure (UV or heat)
  • Fluorescent under UV light