Eliminate mechanical Fasteners

Thermal Adhesives

Eliminate mechanical Fasteners

Thermal Adhesives: High structural Bond Strength in severe Environments

Henkel Liquid Adhesives create a mechanical attachment of a component to a heat sink with thermal transfer properties and without the need for additional fasteners. The Liqui-Bond product line also offers mild elastic properties which assist in relieving CTE mismatches.

High-Throughput Processing

For high-volume operations where automation is non-negotiable, Henkel’s adhesive thermal interface products in liquid, pad and laminate formulations answer the call. Liqui-Bond, Bond-Ply and Bond-Ply LMS offer maximum adhesion in mediums that can be automated either by automatic dispensing equipment or custom solutions for maximum productivity.

Superior Value

Henkel’s thermal adhesives provide the ultimate in value processing. The ability to eliminate mechanical fasteners reduces the need for manual tasks and the ability to automate application of the materials increases production throughput. Together, these characteristics lower overall cost of ownership and maximize investment.

Liquid Adhesives Raise Utilization

Liqui-Bond thermally conductive adhesives allow precise dispensing of material, ensuring only the amount required is used. Eliminate material waste, maximize utilization and simplify part numbers and ordering with Henkel’s liquid thermal adhesives.

Samples When You Need Them

Custom die-cut samples of Bond-Ply pad and Liqui-Bond LMS laminate thermal adhesives can be supplied within days of ordering. Why wait on NPI projects or to solve an immediate challenge? Rely on Henkel to get the job done – quickly.

More Benefits of Liquid Adhesives

  • Liquid:
  • Fewer part numbers
  • Reduces supply chain complexity
  • High throughput
  • Proven equipment capability
  • High value processing
  • Higher thermal performance
  • Long term cost saving effect (total cost of ownership, TCoO)
  • Zero waste
  • Reduces component stress
  • Quick cure times

More Benefits of Liquid Adhesives

  • Tapes / Pads:
  • energy-efficient, no heat cure required
  • High dielectric strength (for one product)
  • High adhesion to metals
  • No capital investment required
  • Quick customer samples
  • Conforms to any topography or architecture
  • Mixed:
  • Eliminates mechanical mounting
  • Local, just-in-time supply
  • Increased reliability

Adhesive Highlights

Bond-Ply 800

  • Thermal impedance: 0.60°C-in2/W (@50 psi)
  • High bond strength to most epoxies and metals
  • Double-sided, pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • More cost-effective than heat-cure adhesive, screw mounting or clip mounting
  • Mount LED assembly to troffer housing
  • Mount LED assembly to heat sink
  • Mount heat spreader onto power converter PCB or onto motor control PCB
  • Mount heat sink to BGA graphic processor or drive processor
View Product Details

Bond-Ply LMS-HD

  • TO-220 Thermal performances: 2.3°C/W, initial pressure only lamination
  • Exceptional dielectric strength
  • Very low interfacial resistance
  • Continuous use of -60 to 180°C
  • Eliminates mechanical fasteners
  • Discrete semi-conductor packages bonded to heat spreader or heat sink
Get more Information View Product Details

Liqui Bond SA2000

  • High thermal conductivity: 2.0 W/m-k
  • Eliminates need for mechanical fasteners
  • One-part formulation for easy dispensing
  • Mechanical and chemical stability
  • Maintains structural bond in severe-environment applications
  • Heat cure
  • PCBA to housing
  • Discrete component to heat spreader
View Product Details

Adhesives

Bond-Ply 100

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008, 0.011
  • Lap Shear @ RT (psi) / (MPa): 100
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply 800

Fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008
  • Lap Shear @ RT (psi) / (MPa): 150
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply LMS-HD

Silicone, high-durability laminate material

  • Thickness (inch) / (mm): 0.010, 0.018
  • Lap Shear @ RT (psi) / (MPa): 200

Liqui-Bond EA 1805

Two-component, epoxy-based, liquid-dispensable adhesive

  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^14
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 1000 (one-part)

One-component, thermally-conductive, silicone adhesive

  • Viscosity (cps): 125,000
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 2000 (one-part)

One-component, thermally-conductive silicone adhesive

  • Viscosity (cps): 200,000
  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Liqui-Bond SA 1800 (one-part)

Thermally Conductive, Polyimide Reinforced, Laminate Material-Silicone

  • Viscosity (cps): 125,000
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^11

Bond-Ply 660P

Highly Durable, Conformable,Thermally Conductive, Gap Filling Material

  • Thickness (inch) / (mm): 0.008
  • Lap Shear @ RT (psi) / (MPa): 100
  • Thermal Conductivity (W/m-K): 0.4

Bond-Ply 400

Thermally Conductive, Self-Leveling, Liquid Gap Filling Material

  • Thickness (inch) / (mm): 0.005 to 0.010
  • Lap Shear @ RT (psi) / (MPa): 100

Liqui-Bond SA 3505

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

TLB 400 SLT

High Performance Silicone Adhesive Sealant With An Adaptable Cure Profile

  • Volume Resistivity (Ohm-meter): 10^12
  • Shelf Life @ 25ºC (months): 6

Liqui-Form 2000

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thermal Conductivity (W/m-K): 2.0
  • Volume Resistivity (Ohm-meter): 10^9

Typical Properties of Bond-Ply

Bond-Ply Thermal Performance

Liqui-Bond Cure Schedule