Exceptional Performance, easy to use

GAP PADS

Exceptional Performance, easy to use

GAP PADS: Greater Conformability, thermal Performance and easier Application

GAP PADS provide effective thermal interfaces between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interface resistance. As well as providing low stress vibration damping and are compatible with automated dispensing equipment.

 

Requires no capital investment

Exceptionally simple to use, Henkel’s GAP PAD materials require no up-front capital investment as the pads can be applied quickly and easily by hand.

 

Manufactured to size, operators simply peel the protective film and place the pad on the desired component.

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

Comprehensive Portfolio

Henkel’s GAP PAD portfolio offers electronics specialists a complete range of choices for highly conformable, easy-to-apply, robust thermal control. 

 

As thin as 0.010 inches to thicknesses of 0.25 inches, and from xxx W/m-K thermal conductivity all the way up to xx W/m-K, GAP PAD has your application covered. 

More GAP PAD Advantages

  • Quick custom samples
  • Assembly flexibility
  • Requires no capital investment
  • Local, just-in-time supply
  • Custom sizes
  • Soft and compliant
  • Compliancy
  • Pre-cured

More GAP PAD Advantages

  • Comprehensive Portfolio
  • Silicone-free options
  • Low-modulus formulations
  • High-compliance materials
  • Thick bondline
  • Reworkability

GAP PAD Highlights

GAP PAD VOUS

  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • "Gel-like" modulus 
  • Decreased strain
  • Puncture, shear and tear resistant
  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnet components and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
View Product Details

GAP PAD HC 3.0

  • Thermal conductivity: 3.0 W/m-K
  • Highly conformable, low compression stress
  • Fiberglass reinforced for shear and tear resistance
  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks
Get more information View Product Details

GAP PAD HC 5.0

  • Thermal Conductivity: 5.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance
  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks
Get more Information View Product Details

GAP PAD 1450

  • Thermal Conductivity: 1.3 W/m-K (Bulk Rubber)
  • Permanent liner reinforcement allows easy rework and resistance to puncture and tear resistance
  • Highly conformable/low hardness
  • Designed for and low-stress applications
  • Lighting and LED applications
  • Low strain is required for fragile component leads
  • Computer and peripherals
  • Telecommunications
  • Between any heat-generating semiconductor and a heat sink
View Product Details

GAP PAD 1500

  • Thermal conductivity: 1.5 W/m-K
  • Un-reinforced construction for additional compliancy
  • Conformable, low hardness
  • Electrically isolating
  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • RDRAM™ memory modules / chip scale packages
  • Areas where heat needs to be transferred to a frame chassis, or other type of heat spreader
View Product Details

GAP PAD

GAP PAD VO

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1000SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 0.9

GAP PAD 1450

Permanent liner, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 1.3

GAP PAD 1500

Unreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.200
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 1500R

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.010 to 0.020
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 2200SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^8
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD 3004SF

Permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD 3500ULM

Ultra-low modulus, fiberglassreinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.5

GAP PAD HC 3.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD A3000

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.015 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 80
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 2.6

GAP PAD HC1000

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.010 to 0.020
  • Hardness (Bulk Rubber) (Shore 00): 25
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD VO Soft

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.200
  • Hardness (Bulk Rubber) (Shore 00): 25
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD VO Ultra Soft

Polyester-Based, Thermally Conductive Insulation Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD A2000

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.010 to 0.040
  • Hardness (Bulk Rubber) (Shore 00): 80
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD 1500S30

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.3

GAP PAD 2000S40

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2

GAP PAD 5000S35

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 5.0

GAP PAD 1000HD

Highly Durable, Conformable, Thermally Conductive, Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD 2500S20

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.010 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 20
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2.4

GAP PAD 3000S30

Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD 2202SF

Fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD EMI 1.0

Thermally Conductive, Self-Leveling, Liquid Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.125
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

GAP PAD VO Ultra Soft-B

Ultra Conformable,Thermally Conductive Material for Filling Air Gaps

  • Thickness (inch) / (mm): 0.020 to 0.250
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD Comparison Table

GAP PAD Thermal Conductivity vs. Hardness

GAP PAD "S Class" Thermal Conductivity vs. Hardness