Flow on Demand Thermal Performance

Phase Change TIMs

Flow on Demand Thermal Performance

Phase Change: Replaces Grease as the Interface between Power Devices and Heat Sinks

Replaces grease, saving time and money without sacrificing thermal performance. Its no mess- thixotropic characteristics keep it from flowing out of the interface, which means it is easier to handle and not tacky at room temperatures.

Why Phase Change?

  • Mess-free alternative to thermal grease; remains solid until specified flow temperature
  • Do not attract contaminants
  • Easy shipping and handling
  • Exceptional thermal performance for CPU reliability
  • Simplified handling; tack-free, tackified and printable formulations
  • Simplified application
  • Reduced Pump out VS grease
  • No protective liner required
  • Inflammability

Phase Change

Hi-Flow 565U

Polyester-Based, Thermally Conductive Insulation Material

  • Thermal Conductivity (W/m-K): 3.5
  • Phase Change Temp (°F) / (°C): 126
  • Thickness (inch) / (mm): 0.010

Hi-Flow 105

Polyester-Based, Thermally Conductive Insulation Material

  • Thermal Conductivity (W/m-K): 0.9
  • Phase Change Temp (°F) / (°C): 149
  • Thickness (inch) / (mm): 0.0055

Hi-Flow 225-F-AC

Polyester-Based, Thermally Conductive Insulation Material

  • Thermal Conductivity (W/m-K): 1.0
  • Phase Change Temp (°F) / (°C): 131
  • Thickness (inch) / (mm): 0.004

Hi-Flow 225U

Polyester-Based, Thermally Conductive Insulation Material

  • Thermal Conductivity (W/m-K): 1.0
  • Phase Change Temp (°F) / (°C): 131
  • Thickness (inch) / (mm): 0.0015

Hi-Flow 225 UT

The Medium Performance Polyimide-Based Insulator

  • Thermal Conductivity (W/m-K): 0.7
  • Phase Change Temp (°F) / (°C): 131
  • Thickness (inch) / (mm): 0.003

Hi-Flow 300G

The Medium Performance Polyimide-Based Insulator

  • Thermal Conductivity (W/m-K): 1.6
  • Phase Change Temp (°F) / (°C): 131
  • Volume Resistivity (Ohm-meter): 10^8
  • Dielectric Breakdown Voltage (Vac): 300
  • Thickness (inch) / (mm): 0.005

Hi-Flow 300P

Dry compound, coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.6
  • Phase Change Temp (°F) / (°C): 131
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.004-0.005

Hi-Flow 565UT

Tacky, High Performance, Un-Reinforced Phase Change TIM

  • Thermal Conductivity (W/m-K): 3.0
  • Phase Change Temp (°F) / (°C): 126
  • Thickness (inch) / (mm): 0.005, 0.010

Hi-Flow 650P

One side is naturally tacky. Coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 1.5
  • Phase Change Temp (°F) / (°C): 126
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.0045 - 0.0055

EIF 1000K3

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

EIF 1000KB

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

EIF 1000KA

Phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.002

TCF 1000ALH

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.004

TCF 1000AL

Phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140
  • Thickness (inch) / (mm): 0.003

TCF 4000

Non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113

Hi-Flow 625

Reinforced Phase Change Thermal Interface Material

  • Thermal Conductivity (W/m-K): 0.5
  • Phase Change Temp (°F) / (°C): 149
  • Volume Resistivity (Ohm-meter): 10^10
  • Dielectric Breakdown Voltage (Vac): 4000
  • Thickness (inch) / (mm): 0.005

Loctite TCP 7000

Non-silicone and reworkable phase change material

  • Thermal Conductivity (W/m-K): > 3.0
  • Phase Change Temp (°F) / (°C): 113

Hi-Flow 330P

Highly Durable, Conformable, Thermally Conductive, Gap Filling Material

  • Thermal Conductivity (W/m-K): 1.4
  • Phase Change Temp (°F) / (°C): 126
  • Volume Resistivity (Ohm-meter): 10^12
  • Dielectric Breakdown Voltage (Vac): 5000
  • Thickness (inch) / (mm): 0.0045-0.0055

TCF 2000 AF

High-performance phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 3.0
  • Phase Change Temp (°F) / (°C): 124
  • Thickness (inch) / (mm): 0.003

TIC 1000A

High Performance, Value Compound for High-End Computer Processors

  • Thermal Conductivity (W/m-K): 1.5
  • Volume Resistivity (Ohm-meter): N/A

TIC 4000

Thermally Conductive, Self-Leveling, Liquid Gap Filling Material

  • Thermal Conductivity (W/m-K): 4.0
  • Volume Resistivity (Ohm-meter): N/A

Hi-Flow Comparison Table

Non-Isolating Hi-Flow Series 105 to 300G Grease Replacement Materials

Non-Isolating Hi-Flow 225 to 565 Grease Replacement Materials

Isolating Hi-Flow Series 300P to 625 Grease Replacement Materials