Exceptional Thermal Performance, Mission-Critical Applications

Aerospace Electronics

Exceptional Thermal Performance, Mission-Critical Applications

Thermal Materials for Aerospace Electronics

The integration of more function into smaller form factors in the aerospace sector is driving the need for highly capable thermal control solutions. Electronics thermal management is critically important in this market – perhaps more so today than ever before. As unmanned vehicles and aircraft and mobile radar systems become more advanced and compact, heat generation increases and effective thermal control is vital to in-operation reliability. As the leading low-risk supplier to top aerospace manufacturers, Henkel’s thermal management products have been enabling applications in this sector for over three decades. Materials solutions include SIL-PAD thermal interface materials that meet tough outgassing and thermal conductivity specifications, GAP PADS that offer a low stress, high conformability TIM option for maximum heat transfer and TCLAD for substrate-level thermal control for the requirements of high powered systems. When reliability is non-negotiable, Henkel thermal materials are on top of every challenge.

SIL-PADS

Why SIL-PADS?

  • Excellent thermal performance
  • Clean, mess-free alternative to grease
  • Provides electrical shorting resistance
  • Simplified, clean application
  • Customizable for various applications

GAP PADS

Requires no capital investment

Exceptionally simple to use, Henkel’s GAP PAD materials require no up-front capital investment as the pads can be applied quickly and easily by hand.

 

Manufactured to size, operators simply peel the protective film and place the pad on the desired component.

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Requires no capital investment
  • Custom sizes
  • Thick bondline

Our recommended Thermal Management Products

SIL-PAD

SIL-PAD 400

Learn more about SIL-PAD 400, the original fiberglass-reinforced, siliconebased insulator

  • Thickness (inch) / (mm): 0.007, 0.009 / 0.178, 0.229
  • Dielectric Breakdown Voltage (Vac): 3500, 4500
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 900S

Learn more about SIL-PAD 900S an high Performance Insulator for Low-Pressure Applications

  • Thickness (inch) / (mm): 0.009 / 0.229
  • Dielectric Breakdown Voltage (Vac): 5500
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1200

Learn more about SIL-PAD 1200 an high-performance, fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009 to 0.016 / 0.229 to 0.406
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^9
  • Flame Rating: V-O

SIL-PAD 2000

Learn more about SIL-PAD 2000 an high-performance, fiberglass-reinforced, silicone-based insulator. Designed for military and aerospace applications

  • Thickness (inch) / (mm): 0.010 - 0.020 / 0.245 - 0.508
  • Dielectric Breakdown Voltage (Vac): 4000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 1500ST (Soft Tack)

Learn more about SIL-PAD 1500ST (Soft Tack) a low-pressure, high-performance, siliconebased insulator

  • Thickness (inch) / (mm): 0.008 / 0.203
  • Dielectric Breakdown Voltage (Vac): 3000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD K-10

Learn more about SIL-PAD K-10 a high-performance, value compound for high-end computer processors

  • Thickness (inch) / (mm): 0.006 / 0.152
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^12
  • Flame Rating: VTM-O

GAP PAD

GAP PAD VO

Learn more about GAP PAD VO a thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1000SF

Learn more about GAP PAD 1000SF a fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 0.9

GAP PAD 1500

Learn more about GAP PAD 1500 a unreinforced, silicone-based pad with an ideal filler blend that gives it a low-modulus characteristic

  • Thickness (inch) / (mm): 0.020 to 0.200 / 0.508 to 5.080
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 1500R

Learn more about GAP PAD 1500R a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.010 to 0.020 / 0.254 to 0.508
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

GAP PAD 2200SF

Learn more about GAP PAD 2200SF a fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^8
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD 3004SF

Learn more about GAP PAD 3004SF a permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD TGP 6000ULM

Learn more about GAP PAD TGP 6000ULM a ultra-low modulus, fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 1.524 to 3.175
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 6.0

GAP PAD 3500ULM

Learn more about GAP PAD 3500ULM a ultra-low modulus, fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.5

GAP PAD HC 3.0

Learn more about GAP PAD HC 3.0 a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Learn more about GAP PAD VO Ultra Soft a polyester-based, thermally conductive insulation material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Learn more about GAP PAD HC 5.0 a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125 / 0.508 - 3.175
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

GAP FILLER

GAP FILLER 3500S35 (Two-Part)

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (hrs): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 3500LV

Learn more about GAP FILLER 3500LV a high-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (hrs): 240
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

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