Maximum Thermal Control for Superb Processing Power

Computing Capability

Maximum Thermal Control for Superb Processing Power

Thermal Materials for Computer, Storage & Gaming

The modern computer sector is about far more than desktops and laptops. As home entertainment systems have taken hold and set-top boxes become multi-functional, computing extends beyond conventional definitions. For desktop and gaming applications, increased CPU and GPU power along with maximum memory performance are musts; managing the heat generated by expanded function is essential. These applications generally have reduced thermal resistance requirements with very thin bondlines, making Henkel’s phase change thermal interface materials the ideal thermal control solution. Similarly, as laptops continue to get thinner and lighter with increased battery capability, thin bondline thermal interface materials with superior thermal performance are required. The TV market has also seen a dramatic shift, as set-top boxes now make the television a virtual computer, combining traditional function in addition to modem, router and streaming technology. For these devices, multiple thermal materials approaches are needed and Henkel’s broad range of GAP PADS and liquid GAP FILLERS enable today’s set-top boxes to unite aesthetics and performance.

GAP PADS

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Local, just-in-time supply
  • Custom sizes
  • Soft and compliant
  • Silicone-free options
  • Low-modulus formulations
  • High-compliance materials
  • Reworkability

GAP FILLERS

Automation-enabled High Throughput - Icon

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

Low Component Stress - Icon

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

More GAP FILLER Advantages

  • Fewer part numbers
  • Automation-enabled High Throughput
  • Low labour
  • Total cost of ownership (TcoO)
  • Broad portfolio
  • Highly conformal (ultra conformability)
  • Improves reliability
  • Low Component Stress
  • Slump-resistant options
  • Low-volatility formulations
  • Form Stability
  • Reworkability

Phase Change

Why Phase Change?

  • Mess-free alternative to thermal grease; remains solid until specified flow temperature
  • Do not attract contaminants
  • Easy shipping and handling
  • Exceptional thermal performance for CPU reliability
  • Simplified handling; tack-free, tackified and printable formulations
  • Simplified application
  • Reduced Pump out VS grease
  • No protective liner required

Our recommended Thermal Management Products

GAP PAD

GAP PAD VO

Learn more about GAP PAD VO a thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1000SF

Learn more about GAP PAD 1000SF a fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 0.9

GAP PAD 1450

Learn more about GAP PAD 1450 a permanent liner, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 1.3

GAP PAD 2200SF

Learn more about GAP PAD 2200SF a fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^8
  • Thermal Conductivity (W/m-K): 2.0

GAP PAD 3004SF

Learn more about GAP PAD 3004SF a permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Learn more about GAP PAD VO Ultra Soft a polyester-based, thermally conductive insulation material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP FILLER

GAP FILLER 3500S35 (Two-Part)

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 3500LV

Learn more about GAP FILLER 3500LV a high-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

Liqui-Form 3500

Learn more about Liqui-Form 3500 a high-performance, one-part, cured gel with thixotropic properties

  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Phase Change

Hi-Flow 565UT

Learn more about Hi-Flow 565UT a tacky, high performance, un-reinforced phase change TIM

  • Thermal Conductivity (W/m-K): 3.0
  • Phase Change Temp (°F) / (°C): 126 / 52
  • Thickness (inch) / (mm): 0.005, 0.010 / 0.127, 0.254

EIF 1000K3

Learn more about EIF 1000K3 a phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140 / 60
  • Thickness (inch) / (mm): 0.004 / 0.102

EIF 1000KB

Learn more about EIF 1000KB a phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140 / 60
  • Thickness (inch) / (mm): 0.003 / 0.076

EIF 1000KA

Learn more about EIF 1000KA a phase-change material coated on thermally-conductive polyimide film

  • Thermal Conductivity (W/m-K): 0.45
  • Phase Change Temp (°F) / (°C): 140 / 60
  • Thickness (inch) / (mm): 0.002 / 0.051

TCF 1000ALH

Learn more about TCF 1000ALH a phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140 / 60
  • Thickness (inch) / (mm): 0.004 / 0.102

TCF 1000AL

Learn more about TCF 1000AL a phase-change material coated on aluminum foil

  • Thermal Conductivity (W/m-K): 1
  • Phase Change Temp (°F) / (°C): 140 / 60
  • Thickness (inch) / (mm): 0.003 / 0.076

TCF 4000

Learn more about TCF 4000 a non-silicone, reworkable phase-change material, free-standing film supplied between two release liners

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 45 /

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113 /

SIL-PAD

SIL-PAD 400

Learn more about SIL-PAD 400, the original fiberglass-reinforced, siliconebased insulator

  • Thickness (inch) / (mm): 0.007, 0.009 / 0.178, 0.229
  • Dielectric Breakdown Voltage (Vac): 3500, 4500
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 900S

Learn more about SIL-PAD 900S an high Performance Insulator for Low-Pressure Applications

  • Thickness (inch) / (mm): 0.009 / 0.229
  • Dielectric Breakdown Voltage (Vac): 5500
  • Volume Resistivity (Ohm-meter): 10^10
  • Flame Rating: V-O

SIL-PAD 1200

Learn more about SIL-PAD 1200 an high-performance, fiberglass-reinforced, silicone-based insulator

  • Thickness (inch) / (mm): 0.009 to 0.016 / 0.229 to 0.406
  • Dielectric Breakdown Voltage (Vac): 6000
  • Volume Resistivity (Ohm-meter): 10^9
  • Flame Rating: V-O

SIL-PAD 2000

Learn more about SIL-PAD 2000 an high-performance, fiberglass-reinforced, silicone-based insulator. Designed for military and aerospace applications

  • Thickness (inch) / (mm): 0.010 - 0.020 / 0.245 - 0.508
  • Dielectric Breakdown Voltage (Vac): 4000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

SIL-PAD 1500ST (Soft Tack)

Learn more about SIL-PAD 1500ST (Soft Tack) a low-pressure, high-performance, siliconebased insulator

  • Thickness (inch) / (mm): 0.008 / 0.203
  • Dielectric Breakdown Voltage (Vac): 3000
  • Volume Resistivity (Ohm-meter): 10^11
  • Flame Rating: V-O

Adhesives

Bond-Ply 100

Learn morge about Bond-Ply 100 a fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008, 0.011 / 0.127, 0.203, 0.279
  • Lap Shear @ RT (psi) / (MPa): 100 / 0.7
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply 800

Learn more about Bond-Ply 800 a fiberglass-reinforced pressure-sensitive adhesive tape

  • Thickness (inch) / (mm): 0.005, 0.008 / 0.127, 0.203
  • Lap Shear @ RT (psi) / (MPa): 150 / 1.0
  • Thermal Conductivity (W/m-K): 0.8

Bond-Ply LMS-HD

Learn more about Bond-Ply LMS-HD a silicone, high-durability laminate material

  • Thickness (inch) / (mm): 0.010, 0.018 / 0.254, 0.457
  • Lap Shear @ RT (psi) / (MPa): 200 / 1.4

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