Maximum Thermal Control for Superb Processing Power

Computing Capability

Maximum Thermal Control for Superb Processing Power

Thermal Materials for Computer, Storage & Gaming

The modern computer sector is about far more than desktops and laptops. As home entertainment systems have taken hold and set-top boxes become multi-functional, computing extends beyond conventional definitions. For desktop and gaming applications, increased CPU and GPU power along with maximum memory performance are musts; managing the heat generated by expanded function is essential. These applications generally have reduced thermal resistance requirements with very thin bondlines, making Henkel’s phase change thermal interface materials the ideal thermal control solution. Similarly, as laptops continue to get thinner and lighter with increased battery capability, thin bondline thermal interface materials with superior thermal performance are required. The TV market has also seen a dramatic shift, as set-top boxes now make the television a virtual computer, combining traditional function in addition to modem, router and streaming technology. For these devices, multiple thermal materials approaches are needed and Henkel’s broad range of GAP PADS and liquid GAP FILLERS enable today’s set-top boxes to unite aesthetics and performance.


Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.


Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Local, just-in-time supply
  • Custom sizes
  • Soft and compliant
  • Silicone-free options
  • Low-modulus formulations
  • High-compliance materials
  • Reworkability


Automation-enabled High Throughput - Icon

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

Low Component Stress - Icon

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

More GAP FILLER Advantages

  • Fewer part numbers
  • Automation-enabled High Throughput
  • Low labour
  • Total cost of ownership (TcoO)
  • Broad portfolio
  • Highly conformal (ultra conformability)
  • Improves reliability
  • Low Component Stress
  • Slump-resistant options
  • Low-volatility formulations
  • Form Stability
  • Reworkability

Phase Change

Why Phase Change?

  • Mess-free alternative to thermal grease; remains solid until specified flow temperature
  • Do not attract contaminants
  • Easy shipping and handling
  • Exceptional thermal performance for CPU reliability
  • Simplified handling; tack-free, tackified and printable formulations
  • Simplified application
  • Reduced Pump out VS grease
  • No protective liner required

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