Thermal Materials for Datacomm Infrastructure
Big data is getting bigger. And faster. The volume of data being generated and the speed at which it is being transferred and processed is mind boggling. All of this data is moving at lighting speed to the cloud, where it is routed, processed and stored. Unlike the name implies, the cloud is not some cool, airy data puff in the sky. In reality, it is many huge, earth-bound buildings called data centers. And they’re hot. The switch from wired to fiber optic connectivity between data centers and racks is stressing optical transceiver capability and, yes, increasing the heat generated by high speeds and big data volumes. Henkel’s thermal solutions such as GAP PADS, liquid GAP FILLERS and phase change thermal interface materials are delivering the thermal management capability required for high-reliability datacom performance. Our super-quiet fan designs are offering rack and data center air movement for cooler, quieter environments. Plus, we’re already working on next-generation materials to support even higher speeds and new technologies; these new products will help big data get even bigger.
