Extensive Claims - Consequent Cooling

Thermal Management for Telecommunications

Extensive Claims - Consequent Cooling

Thermal Materials for Datacomm Infrastructure

Big data is getting bigger. And faster. The volume of data being generated and the speed at which it is being transferred and processed is mind boggling. All of this data is moving at lighting speed to the cloud, where it is routed, processed and stored. Unlike the name implies, the cloud is not some cool, airy data puff in the sky. In reality, it is many huge, earth-bound buildings called data centers. And they’re hot. The switch from wired to fiber optic connectivity between data centers and racks is stressing optical transceiver capability and, yes, increasing the heat generated by high speeds and big data volumes. Henkel’s thermal solutions such as GAP PADS, liquid GAP FILLERS and phase change thermal interface materials are delivering the thermal management capability required for high-reliability datacom performance. Our super-quiet fan designs are offering rack and data center air movement for cooler, quieter environments. Plus, we’re already working on next-generation materials to support even higher speeds and new technologies; these new products will help big data get even bigger.


Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.


Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Quick custom samples
  • Custom sizes
  • Silicone-free options
  • Low-modulus formulations
  • High-compliance materials
  • Thick bondline
  • Reworkability


Minimal Waste

GAP FILLERS are only dispensed where needed in the desired thickness and pattern, keeping material waste to a minimum. 


As the materials are two-part with activation occurring only when each component is mixed, GAP FILLERS are on-demand products used only in the desired volumes as needed, which reduces material waste significantly.

Low Component Stress - Icon

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

More GAP FILLER Advantages

  • Fewer part numbers
  • Total cost of ownership (TcoO)
  • High value processing
  • Minimal Waste
  • Highly conformal (ultra conformability)
  • Improves reliability
  • Low Component Stress
  • Reworkability

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