Thermal Management for Power Applications

Power and Industrial Automation

Thermal Management for Power Applications

Thermal Materials for Power and Industrial Automation

From motor controls to smart meters and wind inverters to EV charging stations, power electronics are a critical functional component of many industrial applications. The conversion and storage of energy is the essence of modern power devices, which are under pressure to reliably provide increasing power in smaller and more custom footprints. Henkel’s thermal management materials portfolio leads the power market when it comes to thermal control solutions, offering exceptional capability for power modules, industrial automation, motion control, power supplies and alternative energy applications. Each power system has unique requirements and Henkel’s broad range of thermal control technologies ensures consistent, reliable performance. From efficiently conducting heat at the board level with TCLAD insulated metal substrates to replacing greases with higher performance phase change materials to superior heat dissipation with thermal adhesives, GAP PADS and liquid GAP FILLER TIMs, Henkel’s thermal solutions for power applications are unmatched.


Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.


Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

More GAP PAD Advantages

  • Quick custom samples
  • Custom sizes


Supply Chain Simplification - Icon

Supply Chain Simplification

Liquid, form-in-place GAP FILLERS are adaptable to multiple applications, allowing single part sourcing for a variety of different jobs. Instead of ordering large quantities pads or films – where each variety of size and thickness is a different part number – a single GAP FILLER product can satisfy thermal control requirements for several products. Simply dispense where needed, the material forms in place and thermal control is achieved. One product, many applications.

Automation-enabled High Throughput - Icon

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

More GAP FILLER Advantages

  • Supply Chain Simplification
  • Automation-enabled High Throughput
  • Low labour
  • Highly conformal (ultra conformability)
  • Improves reliability


Why Adhesives?

  • Liquid:
  • Long term cost saving effect (total cost of ownership, TCoO)
  • Tapes / Pads:
  • High dielectric strength (for one product)
  • High adhesion to metals
  • Mixed:
  • Eliminates mechanical mounting



  • Excellent thermal performance
  • Clean, mess-free alternative to grease
  • Provides electrical shorting resistance
  • Simplified, clean application
  • Customizable for various applications

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