Excellent Heat Management for portable Devices

Thermal Materials for Handheld & Tablet

Excellent Heat Management for portable Devices

Thermal Materials for the Mobile Business

More powerful smartphones, tablets and wearables are pushing the limits of power density. The constant drive to pack exponential increases in capability while simultaneously reducing the space in which to house the expanded function is making thermal control among (if not THE) the most pressing primary reliability issues for today’s handheld devices. The reality is that thermal limits aren’t changing; battery, DRAM and die temperature boundaries remain constant even as their power and capability grow, making heat dissipation more difficult. Henkel’s GAP PAD, liquid GAP FILLER and phase change thermal interface materials are providing the solution. Available in several formats – from custom, die-cut, varying-thickness pads to high-volume, high-throughput liquids – and a range of thermal conductivities, Henkel’s award–winning thermal control materials are making modern mobile connectivity possible.

GAP FILLERS

Automation-enabled High Throughput - Icon

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

Low Component Stress - Icon

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

More GAP FILLER Advantages

  • Fewer part numbers
  • Automation-enabled High Throughput
  • Low labour
  • Total cost of ownership (TcoO)
  • High Thermal Conductivity
  • Thin Bondlines
  • Improves reliability
  • Low Component Stress
  • Slump-resistant options
  • Low-volatility formulations
  • Reworkability

Phase Change

Why Phase Change?

  • Mess-free alternative to thermal grease; remains solid until specified flow temperature
  • Do not attract contaminants
  • Easy shipping and handling
  • Exceptional thermal performance for CPU reliability
  • Simplified handling; tack-free, tackified and printable formulations
  • Simplified application
  • Reduced Pump out VS grease
  • No protective liner required
  • Inflammability

Our recommended Thermal Management Products

GAP PAD

GAP PAD VO

Learn more about GAP PAD VO a thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

GAP PAD 1000SF

Learn more about GAP PAD 1000SF a fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 0.9

GAP PAD HC 3.0

Learn more about GAP PAD HC 3.0 a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

GAP PAD VO Ultra Soft

Learn more about GAP PAD VO Ultra Soft a polyester-based, thermally conductive insulation material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD HC 5.0

Learn more about GAP PAD HC 5.0 a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125 / 0.508 - 3.175
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

GAP FILLER

GAP FILLER 3500S35 (Two-Part)

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (min): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 3500LV

Learn more about GAP FILLER 3500LV a high-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

GAP FILLER 4000

Learn more about GAP FILLER 4000 a high-performance, two-part, liquid gap-filling material

  • Cure @ 25ºC (min): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 4.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

Liqui-Form 3500

Learn more about Liqui-Form 3500 a high-performance, one-part, cured gel with thixotropic properties

  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

Phase Change

Loctite TCP 4000

Reworkable and repeatable phase change thermal interface material

  • Thermal Conductivity (W/m-K): 3.4
  • Phase Change Temp (°F) / (°C): 113 /

Loctite TCP 7000

Non-silicone and reworkable phase change material

  • Thermal Conductivity (W/m-K): > 3.0
  • Phase Change Temp (°F) / (°C): 113 /

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