GAP PAD

GAP PAD HC 3.0

Features & Benefits

  • Thermal conductivity: 3.0 W/m-K
  • Highly conformable, low compression stress
  • Fiberglass reinforced for shear and tear resistance

Description

Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress. Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

Typical Applications include

  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks

Properties

Typical properties of GAP PAD HC 3.0
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Fiberglass Fiberglass ***
Color Blue Blue Visual
Inherent Surface Tack 2 2 ***
Density (Bulk Rubber) (g/cc) 3.1 3.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness (Bulk Rubber) (Shore 00) (1) 15 15 ASTM D2240
Young's Modulus (psi) / (kPa) (2) 16 110 ASTM D575
Typical Use Temp (°F) / (°C) -76 to 392 -60 to 200 ***
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Typical properties of GAP PAD HC 3.0
Electrical Imperial Value Metric Value Test Method
Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149
Dielectric Constant (1000 Hz) (3) 6.5 6.5 ASTM D150
Volume Resistivity (Ohm-meter) 10^10 10^10 ASTM D257
Flame Rating V-O V-O U.L. 94
Typical properties of GAP PAD HC 3.0
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) (3) 3.0 3.0 ASTM D5470
Typical properties of GAP PAD HC 3.0
Property Value Test Method
Shield / Copper Thickness (inches) 1
Typical properties of GAP PAD HC 3.0
Deflection (% strain) 10 20 30
Thermal Impedance (ºC-in2/W) 0.040" 0.57 0.49 0.44
  • (1) Thirty second delay value on Shore 00 hardness scale.

  • (2) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch^2 after 5 minutes of compression at 10% strain on a 1mm thickness material.

  • (3) Minimum value at 20 mil.

Configurations

Configurations available

  • Sheet form and die-cut parts

Downloads

Data Sheet

GAP PAD

Data Sheet

GAP PAD HC 3.0

RoHS Certificate

GAP PAD

RoHS Certificate

GAP PAD HC 3.0

Halogen Testing Report

GAP PAD

Halogen Testing Report

GAP PAD HC 3.0

Safety Data Sheet (SDS)

GAP PAD

Safety Data Sheet (SDS)

GAP PAD HC 3.0
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