Solder Materials

Henkel Solutions across the Board

Solder Materials

Solder Materials: Continuous Innovation in Solder Technology

LOCTITE is the industry’s most trusted name in solder materials. A history of high-performance, innovative development has established LOCTITE solder products as the leading materials for applications from mainstream SMT through to the most advanced, demanding processes. Henkel was among the first to introduce lead-free solder pastes with wide and forgiving process windows, high-reliability lead-free alloys for exacting applications such as automotive and, of course, the industry’s only game-changing temperature stable solder paste. The LOCTITE solder portfolio includes low-voiding lead-free solder pastes, no-clean pastes, water-soluble pastes and cross-over pastes for mixed-metal manufacturing; flux solutions for dual wave and lead-free processes; and cored and solid solder wire and a host of products for delicate hand soldering and re-work operations.

Bar/Liquid Flux

LOCTITE Hydro X20

  • Formerly known as MULTICORE HYDRO-X20
  • Leaves boards very clean with no white residues after washing
  • Highly water-soluble solder residues eliminate CFC usage
  • Efficiently solders copper, brass, nickel and mild steel
  • Meets MIL-P-28809A requirements
  • Compatible with Henkel materials

LOCTITE LF 318 90iSC

  • High reliability
  • Bright solder joints
  • Low impurity levels increase life of alloy in the solder bath and reduce bath maintenance
  • Passes IPC/EIA J-STD-006B requirements
  • Available in standard bar
  • Compatible with Henkel materials

LOCTITE MF 210

  • Formerly known as MULTICORE MF210
  • No-clean
  • Resin-free
  • Designed for surfaces with poor solderability
  • Ideal for consumer electronics and general electrical soldering applications where high throughput is desirable
  • Large process window with sustained performance
  • High-speed soldering on conventional leaded and SMD components; no bridges or icicles
  • Good through-hole penetration
  • Compatible with rosin- and OSP-based surface preservatives
  • Foam, spray or wave applications
  • Compatible with Henkel materials

LOCTITE MF 300

  • Formerly known as MULTICORE MF300
  • Ideal for general soldering applications
  • VOC-free (water-based)
  • No-clean
  • Resin-free
  • Highly effective on low solderability surfaces
  • Special formulation to minimize solder balling
  • Compatible with Henkel materials

LOCTITE MF 390HR

  • Formerly known as MULTICORE MF390HR
  • No-clean
  • Exceptional through-hole penetration
  • Ideal for automotive electronics and general electrical soldering applications
  • No bridges or icicles
  • Sustained performance for maximum process window
  • Passes Telcordia GR-78-CORE requirements
  • Compatible with Henkel materials

LOCTITE MFR 301

  • Formerly known as MULTICORE MFR301
  • Improved wetting on reduced solderability surfaces and to minimize bridging on complex geometries
  • Pb-free
  • No-clean
  • Dual wave compatible
  • Solvent-based flux may be thinned with IPA
  • Compatible with Henkel materials

SAC 305/387/0307

  • Best all-around Pb-free alternative
  • Lowest melting point, high-tin, Pb-free alloy without undesirable additions
  • Enhanced wetting characteristics
  • Passes IPC/EIA J-STD-006B requirements
  • Compatible with Henkel materials

Sn100

  • Bright solder joints
  • Low impurity levels increase life of alloy in the solder bath and reduce bath maintenance
  • Passes IPC/EIA J-STD-006B requirements
  • Available in standard bar, feeder bar, chip and chunks
  • Available in solid wire form
  • Different dimensions available upon request
  • Compatible with Henkel materials

Sn63/60

  • Bright solder joints
  • Low impurity levels increase life of alloy in the solder bath and reduce bath maintenance
  • Passes IPC/EIA J-STD-006B requirements
  • Available in standard bar, feeder bar, chips and chunks
  • Different dimensions available upon request
  • Compatible with Henkel materials

Paste

LOCTITE GC 10

  • Room temperature stable
  • Halogen-free
  • Extended abandon times and stencil life
  • High yield paste volumes with lowest aspect ratio: 20% lower than industry standard
  • Excellent coalescence in air for 0201, 01005 and 0.3 mm pitch components
  • Best-in-class cosmetic appearance for Pb-free solder joints
  • Compatible with LOCTITE UF 3810 underfill; LOCTITE EN 3838T encapsulant; LOCTITE STYCAST PC 62, LOCTITE STYCAST PC 40-UMF, LOCTITE SI 5293, LOCTITE STYCAST PC 18M conformal coatings

LOCTITE GC 3W

  • Room temperature stable
  • Halogen-free
  • Extended abandon times and stencil life
  • Low temperature, shorter cleaning time compared to industry standard
  • Easy residue removal over the longest post-reflow cleaning time: 0201, 0402, BGA, CSP, QFP, QFN (0.23 mm pitch)
  • No change in residue removal after dual reflows
  • No additional saponifiers or co-solvents required
  • Best-in-class cosmetic appearance for Pb-free solder joints
  • Compatible with Henkel materials

LOCTITE HF 212

  • Formerly known as LOCTITE MULTICORE HF 212
  • Halogen-free
  • High tack
  • Low voiding
  • Excellent abandon time and stencil life
  • Excellent fine-pitch coalescence
  • Exceptional solderability in air and nitrogen across a wide range of challenging surface finishes
  • Optimized for long soak reflow
  • Compatible with Henkel materials

LOCTITE HF 250DP

  • Formerly known as LOCTITE MULTICORE HF 250DP
  • Halogen-free
  • Low voiding
  • Low metal content for dispense applications
  • Compatible with Henkel materials

LOCTITE HF 2W

  • Halogen-free
  • Benign residues post-reflow
  • No change in residue removal after dual reflows
  • Low corrosivity of flux residues – boards can be cleaned up to seven days after soldering
  • Easy residue removal over the longest post-reflow cleaning time: 0201, 0402, BGA, CSP, QFP, QFN (0.23 mm pitch)
  • No additional saponifiers or co-solvents required
  • Fine-pitch capability and reduction in solder bridging
  • Low temperature, shorter cleaning time compared to industry standard
  • Compatible with Henkel materials

LOCTITE LF 318

  • Formerly known as MULTICORE LF318
  • Halide-free
  • Excellent humidity resistance
  • High tack to resist component movement during high-speed placement
  • Long abandon times
  • Excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes
  • Compatible with Henkel materials

LOCTITE MP 218

  • Formerly known as LOCTITE MULTICORE MP 218
  • Halide-free
  • High activity
  • Compatible with Henkel materials
  • Soft, nonstick, pin testable residues allow easy in-circuit testing
  • Colorless residues for easy post-reflow inspection
  • Extended open time and tack life, leading to low wastage
  • Outstanding resistance to high-temperature and humid environments

Wire

LOCTITE C 400

  • Formerly known as MULTICORE C400
  • No-clean
  • Clear residue
  • Good wetting
  • Fast soldering
  • Heat stable
  • Increased flux content for improved wetting on challenging surfaces
  • Compatible with Henkel materials

LOCTITE C 502

  • Formerly known as MULTICORE C502
  • Clear residue
  • Medium activity flux with good wetting on difficult substrates
  • Fast soldering
  • Compatible with Henkel materials

LOCTITE C 511

  • Formerly known as MULTICORE C511
  • Amber residue
  • Heat stable
  • Good wetting on difficult substrates
  • Fast soldering
  • Compatible with Henkel materials

LOCTITE Hydro X

  • Formerly known as MULTICORE HYDRO-X
  • High activity
  • Excellent wetting on difficult substrate
  • Fast wetting
  • No insoluble residues
  • No spitting
  • Compatible with Henkel materials

LOCTITE Game Changer

The industry’s first and only temperature stable solder paste materials have forever changed the game – from logistics through to storage and production. Learn more from our wide range of data sheets, press releases and other useful downloads. 

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