Underfills: Reliability for the Mobile Market
Smaller, thinner, highly functional devices are made more reliable and durable with LOCTITE underfills. The undisputed leader in underfill technology, Henkel’s LOCTITE materials provide unmatched reliability performance for modern handheld, wearable and mobile computing devices. LOCTITE CSP and BGA underfill systems accommodate for a variety of applications, providing fast flow, fast cure, long pot life and easy reworkability. Superior shock, drop and vibration resistance characteristics are the hallmarks of LOCTITE underfills, which are enabling today’s the most advanced electronics products.