BERGQUIST GAP PAD TGP HC3000

Soft, gap filling characteristics, conformability and excellent thermal conductivity make BERGQUIST GAP PAD TGP HC3000 the ultimate solution for low assembly stress requirements. This high-compliance TIM is comprised of a low modulus resin formulation and filler package enabling outstanding performance at low pressure. The silicone-based material exhibits high conformability and has elastic properties that reduce stress and encourage excellent wet-out performance.

 

BERGQUIST GAP PAD TGP HC3000 has a natural tack on both sides, which aids in minimizing material shifting during assembly. With thermal conductivity of 3.0W/m-K, BERGQUIST GAP PAD TGP HC3000 has proven performance on a variety of applications including computers, gaming consoles, power conversion devices and telecom devices.

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Benefits of BERGQUIST GAP PAD TGP HC3000

  • Thermal conductivity: 3.0 W/m-K
  • Highly conformable, low compression stress
  • Fiberglass reinforced for shear and tear resistance