Automation and Thermal Performance unite

GAP FILLERS

Automation and Thermal Performance unite

GAP FILLERS: Thermally conductive, liquid gap filling Materials

GAP FILLER is supplied as a two-component, room or elevated temperature curing system, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components on PC boards with an adjacent metal case or heat sink. GAP FILLER is primarily for use in applications where a strong structural bond is not required.

Supply Chain Simplification - Icon

Supply Chain Simplification

Liquid, form-in-place GAP FILLERS are adaptable to multiple applications, allowing single part sourcing for a variety of different jobs. Instead of ordering large quantities pads or films – where each variety of size and thickness is a different part number – a single GAP FILLER product can satisfy thermal control requirements for several products. Simply dispense where needed, the material forms in place and thermal control is achieved. One product, many applications.

Low Component Stress - Icon

Low Component Stress

As compared to thermal pads, liquid thermal interface materials lower overall component stress. Even though pads are soft, the compression applied to the pads once they are placed puts stress on components. GAP FILLERS, on the other hand, require significantly less force to wet out the liquid. These unique materials flow into all of the voids of even the most delicate circuitry and then cure in place to form a solid pad-like structure, which also safeguards against shock, vibration, drop, expansion and mechanical stress.

Automation-enabled High Throughput - Icon

Automation-enabled High Throughput

When speed, high throughput and exceptional thermal control are the challenges, GAP FILLERS are the solution. Applied via automated dispensing systems, GAP FILLERS facilitate high-volume production speeds while sacrificing nothing in the way of thermal management capability. Two-part GAP FILLERS are dispensed quickly, flow in and around even the most delicate circuitry, form in place and compensate for the large tolerances between the heat-generating device and its housing or heat sink counterpart.

Minimal Waste

GAP FILLERS are only dispensed where needed in the desired thickness and pattern, keeping material waste to a minimum. 

 

As the materials are two-part with activation occurring only when each component is mixed, GAP FILLERS are on-demand products used only in the desired volumes as needed, which reduces material waste significantly.

More Reasons for GAP FILLERS

  • Fewer part numbers
  • Supply Chain Simplification
  • Vision system designed (for detection)
  • Automation-enabled High Throughput
  • Low labour
  • Total cost of ownership (TcoO)
  • High Thermal Performance
  • High Thermal Conductivity
  • Thin Bondlines
  • Proven equipment capability
  • Conforms to any Topography or Architecture
  • Broad portfolio

More Reasons for GAP FILLERS

  • High value processing
  • Minimal Waste
  • High Utilisation
  • Highly conformal (ultra conformability)
  • Improves reliability
  • Low Component Stress
  • Slump-resistant options
  • Low-volatility formulations
  • Form Stability
  • Reworkability

BERGQUIST GAP FILLER Highlights

GAP FILLER TGF 4000

  • Thermal Conductivity: 4.0 W/m-K
  • Extended working time for manufacturing flexibility
  • Ultra-conforming with excellent wet-out
  • 100% solids - no cure by-products
  • Excellent low and high temperature chemical and mechanical stability
  • Between any heat-generating semiconductor and a heat sink
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GAP FILLER TGF 1500LVO

  • Thermal conductivity: 1.8 W/mK
  • Low volatility for silicone sensitive applications
  • Ultra-conforming, with excellent wet-out
  • 100% solids — no cure by-products
  • Excellent low and high temperature mechanical and chemical stability
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GAP FILLER TGF 3500LVO

  • Thermal Conductivity: 3.5 W/m-K
  • Low volatility for outgassing sensitive applications
  • Ultra-conforming with excellent wet-out for low stress interfaces on applications
  • 100% solids - no cure by-products
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GAP FILLER TGF 1400SL

  • Thermal Conductivity: 1.4 W/m-K
  • Self-Leveling
  • Very Soft
  • Vibration Dampening
  • Encapsulating semiconductors and magnetic components with heatsink
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GAP FILLER

BERGQUIST GAP FILLER TGF 1000SR

Learn more about BERGQUIST GAP FILLER TGF 1000SR a two-part, liquid gap-filling material featuring superior slump resistance.

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (hrs): 20
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.0
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 1100SF

Learn more about BERGQUIST GAP FILLER TGF 1100SF a thermally conductive, self-leveling, liquid gap filling material

  • Pot Life @ 25ºC (min): 240 min (4 hr)
  • Cure @ 25ºC (hrs): 24
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.1
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 1450

Learn more about BERGQUIST GAP FILLER TGF 1450 a two-part, high performance, thermally conductive liquid gap filling material.

  • Pot Life @ 25ºC (min): 60 min
  • Cure @ 25ºC (hrs): 5 hours
  • Cure @ 100ºC (min): 10 min
  • Thermal Conductivity (W/m-K): 1.5
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 1000

Learn more about BERGQUIST GAP FILLER TGF 1000 a thermally conductive, self-leveling, liquid gap filling material

  • Pot Life @ 25ºC (min): 15
  • Cure @ 25ºC (hrs): 60-120
  • Cure @ 100ºC (min): 5
  • Thermal Conductivity (W/m-K): 1
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 1500LVO

Two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (hrs): 8
  • Cure @ 100ºC (min): 10
  • Thermal Conductivity (W/m-K): 1.8
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 2000

Learn more about BERGQUIST GAP FILLER TGF 2000 a thermally conductive, self-leveling, liquid gap filling material

  • Pot Life @ 25ºC (min): 15 min
  • Cure @ 25ºC (hrs): 1-2 hours
  • Cure @ 100ºC (min): 5 min
  • Thermal Conductivity (W/m-K): 2
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 3600

High-performance, two-part, liquid gap-filling material with superior softness

  • Pot Life @ 25ºC (min): 60
  • Cure @ 25ºC (hrs): 15
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.6
  • Volume Resistivity (Ohm-meter): 10^9
  • Shelf Life @ 25ºC (months): 5

BERGQUIST GAP FILLER TGF 3500LVO

Learn more about BERGQUIST GAP FILLER TGF 3500LVO a high-performance, two-part, liquid gap-filling material with significantly lower levels of silicone outgassing

  • Cure @ 25ºC (hrs): 240
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

BERGQUIST GAP FILLER TGF 4000

Learn more about BERGQUIST GAP FILLER TGF 4000 a high-performance, two-part, liquid gap-filling material

  • Cure @ 25ºC (hrs): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 4.0
  • Volume Resistivity (Ohm-meter): 10^10
  • Shelf Life @ 25ºC (months): 5

BERGQUIST LIQUI FORM TLF LF3500

Learn more about BERGQUIST LIQUI FORM TLF LF3500 a high-performance, one-part, cured gel with thixotropic properties

  • Thermal Conductivity (W/m-K): 3.5
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

BERGQUIST GAP FILLER TGF 1400SL

Thermally Conductive, Self-Leveling, Liquid Gap Filling Material

  • Cure @ 25ºC (hrs): 24
  • Cure @ 100ºC (min): 30
  • Thermal Conductivity (W/m-K): 1.4
  • Volume Resistivity (Ohm-meter): 10^11
  • Shelf Life @ 25ºC (months): 6

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