Exceptional Performance, easy to use

GAP PADS

Exceptional Performance, easy to use

GAP PADS: Greater Conformability, thermal Performance and easier Application

GAP PADS provide effective thermal interfaces between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interface resistance. As well as providing low stress vibration damping and are compatible with automated dispensing equipment.

 

Requires no capital investment

Exceptionally simple to use, Henkel’s GAP PAD materials require no up-front capital investment as the pads can be applied quickly and easily by hand.

 

Manufactured to size, operators simply peel the protective film and place the pad on the desired component.

Customized Sizes

GAP PADS are manufactured in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements.

 

Available as custom die cut parts with the ability to individualize thickness and constructions, GAP PADS are always fit for purpose to ensure optimized thermal control no matter what the application.

Comprehensive Portfolio

Henkel’s GAP PAD portfolio offers electronics specialists a complete range of choices for highly conformable, easy-to-apply, robust thermal control. 

 

As thin as 0.010 inches to thicknesses of 0.25 inches, and from xxx W/m-K thermal conductivity all the way up to xx W/m-K, GAP PAD has your application covered. 

More GAP PAD Advantages

  • Quick custom samples
  • Assembly flexibility
  • Requires no capital investment
  • Local, just-in-time supply
  • Custom sizes
  • Soft and compliant
  • Compliancy
  • Pre-cured

More GAP PAD Advantages

  • Comprehensive Portfolio
  • Silicone-free options
  • Low-modulus formulations
  • High-compliance materials
  • Thick bondline
  • Reworkability

BERGQUIST GAP PAD Highlights

GAP PAD TGP 1000VOUS

  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • "Gel-like" modulus 
  • Decreased strain
  • Puncture, shear and tear resistant
  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnet components and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
View Product Details

GAP PAD TGP HC3000

  • Thermal conductivity: 3.0 W/m-K
  • Highly conformable, low compression stress
  • Fiberglass reinforced for shear and tear resistance
  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks
Get more information View Product Details

GAP PAD TGP HC5000

  • Thermal Conductivity: 5.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance
  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks
Get more Information View Product Details

GAP PAD TGP 1500

  • Thermal conductivity: 1.5 W/m-K
  • Un-reinforced construction for additional compliancy
  • Conformable, low hardness
  • Electrically isolating
  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • RDRAM™ memory modules / chip scale packages
  • Areas where heat needs to be transferred to a frame chassis, or other type of heat spreader
View Product Details

GAP PAD

BERGQUIST GAP PAD TGP 800VO

Learn more about BERGQUIST GAP PAD TGP 800VO a thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 0.8

BERGQUIST GAP PAD TGP 1500

Learn more about BERGQUIST GAP PAD TGP 1500 a unreinforced, silicone-based pad with an ideal filler blend that gives it a low-modulus characteristic

  • Thickness (inch) / (mm): 0.020 to 0.200 / 0.508 to 5.080
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

BERGQUIST GAP PAD TGP 1500R

Learn more about BERGQUIST GAP PAD TGP 1500R a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.010 to 0.020 / 0.254 to 0.508
  • Hardness (Bulk Rubber) (Shore 00): 40
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.5

BERGQUIST GAP PAD TGP 3004SF

Learn more about BERGQUIST GAP PAD TGP 3004SF a permanent liner, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 3.0

BERGQUIST GAP PAD TGP 6000ULM

Learn more about BERGQUIST GAP PAD TGP 6000ULM a ultra-low modulus, fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 1.524 to 3.175
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 6.0

BERGQUIST GAP PAD TGP 3500ULM

Learn more about BERGQUIST GAP PAD TGP 3500ULM a ultra-low modulus, fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.5

BERGQUIST GAP PAD TGP HC3000

Learn more about BERGQUIST GAP PAD TGP HC3000 a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 15
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 3.0

BERGQUIST GAP PAD TGP A2600

Learn more about BERGQUIST GAP PAD TGP A2600 a thermally conductive, reinforced, soft “S-Class” gap filling material

  • Thickness (inch) / (mm): 0.015 to 0.125 / 0.381 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 80
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 2.6

BERGQUIST GAP PAD TGP 1000VOUS

Learn more about BERGQUIST GAP PAD TGP 1000VOUS a polyester-based, thermally conductive insulation material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

BERGQUIST GAP PAD TGP A2000

Learn more about BERGQUIST GAP PAD TGP A2000 a thermally conductive, reinforced, soft “S-Class” gap filling mate

  • Thickness (inch) / (mm): 0.010 to 0.040 / 0.254 to 1.016
  • Hardness (Bulk Rubber) (Shore 00): 80
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2.0

BERGQUIST GAP PAD TGP 1300

Learn more about BERGQUIST GAP PAD TGP 1300 a thermally conductive, reinforced, soft “S-Class” gap filling ,material

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.3

BERGQUIST GAP PAD TGP 2000

Learn more about BERGQUIST GAP PAD TGP 2000 a thermally conductive, reinforced, soft “S-Class” gap filling material

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2

BERGQUIST GAP PAD TGP 5000

Learn more about BERGQUIST GAP PAD TGP 5000 a thermally conductive, reinforced, soft “S-Class” gap filling material

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 5.0

BERGQUIST GAP PAD TGP 2400

Learn more about BERGQUIST GAP PAD TGP 2400 a thermally conductive, reinforced, soft “S-Class” gap filling material

  • Thickness (inch) / (mm): 0.010 to 0.250 / 0.254 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 20
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2.4

BERGQUIST GAP PAD TGP 3000

Learn more about BERGQUIST GAP PAD TGP 3000 a thermally conductive, reinforced, soft “S-Class” gap filling material

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 30
  • Volume Resistivity (Ohm-meter): 10^9
  • Thermal Conductivity (W/m-K): 3.0

BERGQUIST GAP PAD TGP 2202SF

Learn more about BERGQUIST GAP PAD TGP 2202SF a fiberglass-carrier, silicone-free polymer pad

  • Thickness (inch) / (mm): 0.010 to 0.125 / 0.254 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 70
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 2.0

BERGQUIST GAP PAD TGP EMI1000

Learn more about BERGQUIST GAP PAD TGP EMI1000 a thermally conductive, self-leveling, liquid gap filling material

  • Thickness (inch) / (mm): 0.020 to 0.125 / 0.508 to 3.175
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 1.0

BERGQUIST GAP PAD TGP HC5000

Learn more about BERGQUIST GAP PAD TGP HC5000 a fiberglass-reinforced, silicone-based pad

  • Thickness (inch) / (mm): 0.020 - 0.125 / 0.508 - 3.175
  • Hardness (Bulk Rubber) (Shore 00): 35
  • Volume Resistivity (Ohm-meter): 10^10
  • Thermal Conductivity (W/m-K): 5.0

BERGQUIST GAP PAD TGP 1000VOUSB

Learn more about BERGQUIST GAP PAD TGP 1000VOUSB an ultra conformable, thermally conductive material for filling air gaps

  • Thickness (inch) / (mm): 0.020 to 0.250 / 0.508 to 6.350
  • Hardness (Bulk Rubber) (Shore 00): 5
  • Volume Resistivity (Ohm-meter): 10^11
  • Thermal Conductivity (W/m-K): 1.0

GAP PAD Comparison Table

GAP PAD Thermal Conductivity vs. Hardness

GAP PAD "S Class" Thermal Conductivity vs. Hardness